Acoustic Device Package With Cap Inductor for Compact Signal Filtering
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Solution Overview
Problem
There is a need for acoustic devices with better form factors and smaller sizes as devices have become smaller, requiring improved packaging solutions that maintain effective signal filtering capabilities.
Innovation Solution
A package design incorporating an acoustic device with a cap substrate that includes an inductor, coupled through a polymer or metal frame, creating a cavity between the acoustic device and the cap substrate, which reduces the overall footprint while maintaining signal filtering efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the package size is reduced to improve form factor, then the device can be integrated into smaller applications, but the signal filtering capabilities and electrical connection reliability may deteriorate
Solution Approach 1:
The patent transitions from a planar layout to a three-dimensional stacked architecture, placing the cap substrate vertically above the acoustic device substrate. This dimensional change allows multiple functional components (acoustic device, inductor, capacitor) to be integrated in the vertical dimension while maintaining compact horizontal footprint, thus reducing overall package size without compromising signal filtering capabilities
Solution Approach 2:
The cap substrate is positioned within the vertical space above the acoustic device substrate, creating a nested configuration where the inductor and capacitor are integrated within the cap substrate structure. This nesting approach maximizes space utilization and enables compact packaging while preserving the electrical connection reliability through direct vertical interconnections
2Volume of moving object
If the package size is reduced to improve form factor, then the device can be integrated into smaller applications, but the electrical connection paths may become insufficient
Solution Approach 1:
The electrical connection system is segmented into multiple independent interconnect paths, with at least two separate electrical connections established between the acoustic device substrate and the cap substrate. This segmentation provides redundant signal paths and enables versatile electrical connectivity options (signal, power, ground) within the compact stacked package structure
Solution Approach 2:
The cap substrate serves multiple functions simultaneously: it acts as an electrical connection platform, houses the inductor component, provides mechanical support, and enables vertical stacking. This multi-functionality allows the compact package to maintain adequate electrical connection paths while minimizing overall size
3Reliability
If the acoustic device is stressed during assembly to achieve proper contact, then the connection reliability may improve, but the device performance and signal filtering capabilities may deteriorate
Solution Approach 1:
The patent employs a compliant interconnect structure that dynamically adapts to dimensional variations and stress conditions during assembly. The compliant nature of the interconnect allows it to flex and accommodate assembly tolerances without requiring high-stress bonding, thereby maintaining both connection reliability and acoustic device performance without degradation
Data Source
AI summary
A package that includes an acoustic device, a frame coupled to the acoustic device and a cap substrate coupled to the acoustic device through the frame. The acoustic device includes a substrate and an acoustic element coupled to the substrate. The cap substrate includes an inductor. The cap substrate is configured as a cap for the acoustic device. The package includes a cavity located between the acoustic device and the cap substrate. The frame may include a polymer frame.