Acoustic Package Covering Structure with Segmented Openings
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Solution Overview
Problem
Acoustic components, such as MEMS structures, require protective packaging due to their small size and fragility, but existing packaging structures often compromise on acoustic resistance.
Innovation Solution
A sound producing package structure with a covering structure featuring multiple first openings to enhance protection and reduce acoustic resistance, incorporating a substrate, sound producing component with a membrane and actuator, and strategically designed openings to balance protection and acoustic performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a covering structure is provided to protect acoustic components, then protective effect is improved, but acoustic resistance increases
Solution Approach 1:
The covering structure is divided into multiple sections with a through hole passing through it, creating segmented open spaces. This segmentation allows acoustic waves to pass through multiple pathways while maintaining structural protection, thereby reducing acoustic resistance while preserving protective functionality.
Solution Approach 2:
The covering structure incorporates open spaces and through holes that create a porous-like configuration. This allows acoustic waves to penetrate through the covering structure with minimal resistance while the solid portions maintain protective coverage over the acoustic components.
2Object-affected harmful factors
If the covering structure has openings to reduce acoustic resistance, then acoustic resistance decreases, but protective effect deteriorates
Solution Approach 1:
Rather than creating one large opening, the design segments the opening into a through hole with surrounding open spaces. This segmentation distributes the acoustic flow paths while maintaining adequate coverage and protection over the acoustic components.
Solution Approach 2:
The covering structure extends in multiple dimensions with the through hole passing through the covering structure from one side to another. This three-dimensional configuration allows acoustic waves to pass through while the covering structure maintains protective coverage from multiple angles and directions.
3Reliability
If the acoustic package structure is sealed for protection, then protective effect is improved, but acoustic wave transmission is blocked
Solution Approach 1:
The covering structure is segmented with a through hole and open spaces, creating multiple pathways for acoustic wave transmission. This segmented design allows the structure to remain protective while enabling acoustic waves to pass through the openings without complete blockage.
Solution Approach 2:
The covering structure functions as a protective shell with integrated openings. This shell configuration provides protection for the acoustic components while the openings in the shell allow acoustic wave transmission, combining protective and transmissive functions in a single structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a high protective effect for acoustic chips while minimizing acoustic resistance, allowing for adjustable frequency responses and acoustic wave characteristics, enhancing the yield rate of acoustic devices and flexibility in meeting user requirements.
Implementation Method 1
the sound producing component includes a membrane and an actuator, and the sound producing component is configured to generate an acoustic wave
Data Source
AI summary
A sound producing package includes a substrate, a covering structure and a sound producing component. The covering structure is disposed on the substrate, wherein the covering structure has a plurality of first openings. The sound producing component is disposed between the substrate and the covering structure, wherein the sound producing component includes a membrane and an actuator, and the sound producing component is configured to generate an acoustic wave.