Acoustic Porting for Portable Communication Device
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Solution Overview
Problem
Portable audio communication devices face challenges in achieving optimal low audio frequency response and echo suppression due to limited space for earpiece enclosures, leading to water intrusion issues and poor acoustic echo loss performance in full duplex communication.
Innovation Solution
An earpiece enclosure with an array of specially designed high mass inertance micro-ports minimizes acoustic coupling and provides improved echo suppression, eliminating the need for external acoustical leak ports and ensuring water-proofing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If audio leak ports are used to improve low frequency response, then low audio frequency response is improved, but water intrusion problems occur
Solution Approach 1:
The patent applies porous materials by using a microporous membrane material for the earpiece enclosure. This membrane allows acoustic energy to pass through (improving low frequency response) while its pore structure prevents water molecules from penetrating (preventing water intrusion). The microporous structure acts as an acoustic filter that permits sound waves while blocking liquid water.
Solution Approach 2:
The patent uses a thin film approach with a microporous membrane that serves as both the earpiece enclosure and acoustic port. This thin film structure provides the necessary acoustic transparency for low frequency response while maintaining water protection, replacing the need for separate leak ports and blocking structures.
2Reliability
If external acoustical leak ports are used to improve low frequency response, then low audio frequency response is improved, but acoustic echo loss performance deteriorates
Solution Approach 1:
The microporous membrane material provides selective acoustic transmission. The pore size and distribution are controlled to allow low frequency acoustic energy to pass through while attenuating higher frequency echo signals. This selective filtering improves low frequency response while maintaining acceptable acoustic echo loss performance.
Solution Approach 2:
The earpiece enclosure is designed with non-uniform micropore distribution, where different regions have different pore sizes and densities. This local variation in material properties optimizes acoustic transmission for low frequencies in specific areas while providing echo suppression in other regions, achieving both goals simultaneously.
3Reliability
If earpiece enclosure size is increased to improve low frequency response, then low audio frequency response is improved, but device size increases
Solution Approach 1:
The patent employs a thin microporous membrane film as the earpiece enclosure, replacing traditional bulky enclosure structures. This thin film approach maintains the acoustic volume necessary for low frequency response while minimizing the physical space required, thus keeping the device compact.
Solution Approach 2:
The microporous membrane material provides high acoustic transparency in a thin profile. The porous structure allows acoustic waves to pass through effectively, providing good low frequency response without requiring a large enclosure volume, thereby enabling compact device design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves enhanced low frequency response and echo suppression, improving acoustic echo loss performance while preventing fluid intrusion, thus addressing critical design parameters without requiring complex DSP algorithms or assemblies.
Implementation Method 1
an array of specially designed micro-ports minimizes echo
Implementation Method 2
the earpiece enclosure comprises a microporous membrane material having an array of micro-ports
Data Source
AI summary
A portable full duplex communication device (100) is provided with improved acoustic porting (114) by providing an earpiece enclosure (108) within the housing (102) of device. The earpiece enclosure (108) includes an array of micro-ports (114) formed to provide optimal low frequency response and echo performance without the use of external acoustical leak ports to the housing.