Resin Composition for Acoustic Matching Layer
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Solution Overview
Problem
Existing resin compositions for acoustic matching layers in acoustic probes require high temperatures for long periods, leading to reduced pot life and increased production costs, while also lacking sufficient mechanical strength and density for efficient ultrasonic wave propagation.
Innovation Solution
A resin composition comprising metal particles, a specific epoxy resin, a polythiol compound, and a cure-accelerating compound, which maintains a sufficient pot life and undergoes rapid curing under mild conditions, forming a high-density acoustic matching layer with enhanced mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high temperature curing is used for the acoustic matching layer, then the density and mechanical strength are improved, but the pot life is reduced and production costs increase
Solution Approach 1:
The patent changes the curing parameters from high temperature/long time to mild temperature/short time by introducing a cure-accelerating compound. This allows the resin composition to cure rapidly at lower temperatures, maintaining mechanical strength while extending pot life and reducing production costs.
Solution Approach 2:
The cure-accelerating compound acts as an intermediary that facilitates the curing reaction between the epoxy resin and polythiol compound at mild temperatures. This mediator enables rapid curing without requiring high temperature, thus resolving the contradiction between achieving sufficient mechanical strength and maintaining extended pot life.
2Quantity of substance
If high temperature curing is used for the acoustic matching layer, then the density is improved, but the production costs increase
Solution Approach 1:
The patent changes the curing conditions from high temperature to mild temperature by adding a cure-accelerating compound. This parameter change achieves the desired density of the acoustic matching layer without incurring high production costs associated with energy-intensive high temperature processing.
Solution Approach 2:
The cure-accelerating compound serves as an intermediary that enables the resin to achieve high density at mild curing temperatures. This eliminates the need for expensive high temperature equipment and energy consumption, thereby reducing production costs while maintaining the required density.
3Duration of action of moving object
If the resin composition cures slowly, then the pot life is extended, but the productivity is reduced
Solution Approach 1:
The patent introduces a cure-accelerating compound that changes the curing kinetics, enabling rapid curing at mild temperatures. This resolves the contradiction by allowing the process to maintain extended pot life for handling while achieving fast curing when needed, thus improving productivity without sacrificing pot life.
Solution Approach 2:
The curing process is made dynamic through the use of a cure-accelerating compound that can be activated at specific stages. The resin composition maintains a slow curing rate during handling (extended pot life) but can rapidly cure when the accelerator is activated, providing flexibility to optimize both pot life and productivity based on process requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition allows for the formation of an acoustic matching layer with desired density and mechanical strength, improving the efficiency of ultrasonic wave propagation and extending the product life of acoustic probes while reducing production costs.
Implementation Method 1
a resin composition for an acoustic matching layer includes metal particles (A), an epoxy resin (B), a polythiol compound (C), and a cure-accelerating compound (D)
Implementation Method 2
a resin composition for an acoustic matching layer includes metal particles (A), an epoxy resin (B), a polythiol compound (C), and a cure-accelerating compound (D)
Implementation Method 3
Ultrasonic waves oscillated from the piezoelectric element pass through the acoustic matching layer and further through the acoustic lens to enter a living body
Data Source
AI summary
Provided is a resin composition for an acoustic matching layer, the resin composition including metal particles (A), an epoxy resin (B), a polythiol compound (C), and a cure-accelerating compound (D). The epoxy resin (B) includes at least one epoxy resin selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and phenol novolac epoxy resins, and the polythiol compound (C) includes a compound having at least two specific partial structures. Also provided are a cured product formed of the composition, an acoustic matching sheet, an acoustic probe, an acoustic measuring apparatus, and a method for producing an acoustic probe. Further provided is an acoustic matching layer material set suitable for preparation of the composition.