Acoustic Wave Resonator Busbar Layout for Higher Power Handling
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Solution Overview
Problem
Acoustic wave devices with multiple one-port resonators connected in series face issues with heat dissipation, leading to temperature rises and electrochemical migration, which reduces their electric power handling capability.
Innovation Solution
The acoustic wave device design includes a configuration where IDT electrodes and reflectors are connected via shared busbars in a direction intersecting the acoustic wave propagation, allowing for improved heat dissipation and reducing the likelihood of electrochemical migration by ensuring that heat can escape effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple one-port acoustic wave resonators are connected in series with IDT electrodes electrically connected in series, then the acoustic wave device can be constructed with a compact layout, but heat dissipation deteriorates and temperature rises in the IDT electrodes
Solution Approach 1:
The patent transitions from a one-dimensional series connection layout to a two-dimensional arrangement where IDT electrodes are connected in series along the acoustic wave propagation direction while reflectors are connected in parallel in the vertical direction. This dimensional change enables effective heat dissipation paths without compromising the compact layout, resolving the contradiction between compactness and temperature control.
2Device complexity
If IDT electrodes are closely spaced in series connection, then device complexity is reduced, but electrochemical migration risk increases due to poor heat dissipation
Solution Approach 1:
The patent introduces a vertical connection dimension for reflectors while maintaining horizontal series connection for IDT electrodes. This creates a three-dimensional heat dissipation network that enhances reliability by preventing electrochemical migration, without significantly increasing connection structure complexity.
Solution Approach 2:
The patent segments the heat dissipation function by separating IDT electrode connections (series for signal integrity) from reflector connections (parallel for heat dissipation). This segmentation allows each component to be optimized independently, maintaining low device complexity while improving reliability through enhanced thermal management.
3Power
If power is applied to series-connected IDT electrodes, then the acoustic wave device functions as intended, but temperature rises and electrochemical migration occurs reducing power handling capability
Solution Approach 1:
The patent enables simultaneous power handling and temperature control by creating a dual-path structure: series connection for acoustic signal processing and parallel reflector connections for thermal management. This allows the device to function at higher power levels without excessive temperature rise or electrochemical migration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the electric power handling capability of the acoustic wave devices by preventing temperature rises in the IDT electrodes, thereby reducing the risk of electrochemical migration and maintaining performance even at higher power inputs.
Implementation Method 1
In acoustic wave resonators, when power is applied, temperature tends to rise in the IDT electrodes
Implementation Method 2
the reflectors adjacent to each other in the direction intersecting the acoustic wave propagation direction are connected by a conductive pattern along the acoustic wave propagation direction of each reflector
Data Source
AI summary
An acoustic wave device includes first to third acoustic wave resonators connected in series, and the first acoustic wave resonator and the third acoustic wave resonator are respectively disposed on one side and another side of the second acoustic wave resonator. In the first to third acoustic wave resonators, a first common busbar is connected to one of reflectors of the first and second acoustic wave resonators, and a second common busbar is connected to one of reflectors of the second and third acoustic wave resonators.