Substrate-Integrated Inductor Layout for Acoustic Wave Resonators
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing acoustic wave devices face challenges in integrating inductors without significantly increasing the device size, which is crucial for enhancing performance in radio frequency applications such as filters and phase shifters, while maintaining hermeticity and minimizing interference between resonators and inductors.
Innovation Solution
The integration of inductors with the substrate or lid of acoustic wave devices, forming an inductor integrated substrate or lid, which includes spiral inductors on one or both sides of the substrate/lid, and using low dielectric loss polymeric materials for overcoat layers to enhance performance and minimize interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If inductors are integrated with the substrate or lid, then device size is reduced, but interference between resonators and inductors increases
Solution Approach 1:
The patent applies local quality by positioning the inductor at a specific location on the lid that is spatially separated from the resonator region. This localized placement allows the inductor to be integrated into the device structure without causing significant interference with the resonator operation, thus reducing device size while minimizing harmful interactions.
Solution Approach 2:
The patent introduces a dielectric layer as an intermediary between the inductor and the resonator. This intermediate structure acts as a barrier that reduces electromagnetic interference between the inductor and resonator, enabling closer integration and smaller device size while maintaining performance.
2Device complexity
If inductors are integrated with the substrate or lid, then manufacturing complexity is reduced, but interference between resonators and inductors increases
Solution Approach 1:
The patent merges the inductor structure with the lid by forming the inductor directly on the lid using the same fabrication processes. This integration reduces manufacturing complexity by eliminating separate assembly steps for the inductor, while the strategic positioning on the lid maintains adequate separation from the resonator to minimize interference.
Solution Approach 2:
A dielectric layer is introduced as an intermediary structure between the inductor and resonator. This intermediate layer is formed as part of the integrated fabrication process, reducing manufacturing complexity while simultaneously providing electrical isolation to minimize interference between the inductor and resonator.
3Reliability
If low dielectric loss polymeric materials are used for overcoat layers, then resonator coupling is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent changes the material parameter of the overcoat layer by selecting low dielectric loss polymeric materials with specific electrical properties. This material selection improves resonator coupling by reducing dielectric losses, while the standard deposition techniques can accommodate these materials without requiring extreme manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration allows for improved resonator coupling, reduced interference, and enhanced filter performance without increasing the device size, while maintaining hermeticity and enabling precise control of filter response characteristics.
Implementation Method 1
an inductor formed with the lid, the inductor at least partially positioned over a portion of the resonator
Implementation Method 2
A surface acoustic wave resonator can include an interdigital transductor electrode on a piezoelectric substrate. The surface acoustic wave resonator can generate a surface acoustic wave on a surface of the piezoelectric layer
Data Source
AI summary
An acoustic wave device is disclosed. The acoustic wave device can include a substrate, a resonator and an inductor. The substrate has a first side and a second side opposite the first side. The resonator is positioned over the first side of the substrate. The inductor is formed with the substrate. At least a portion of the inductor is disposed on the second side of the substrate.