Acoustic Resonator Packaging with Low-Resistivity Circuit Layer
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Solution Overview
Problem
Electrical signals transmitted between packaged acoustic components and external electronic circuitry suffer from loss and noise due to interconnect lead length, degrading the performance of devices that combine electronic circuitry and acoustic devices.
Innovation Solution
A hermetically sealed packaging arrangement where a base substrate with an acoustic resonator is bonded to a cap substrate, featuring a material layer with lower resistivity for electronic circuitry that is electrically isolated from the bonding pad seal, allowing direct electrical connection without passing through the seal, thus minimizing signal loss and noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a lead or wire is used to connect the packaged acoustic resonator to external electronic circuitry, then electrical connection is established, but signal loss and noise increase due to interconnect lead length
Solution Approach 1:
The patent merges the acoustic resonator package with the electronic circuit board by directly bonding the resonator to the board, eliminating the separate lead or wire connection. This integration removes the interconnect lead length that causes signal loss and noise, while maintaining all necessary electrical connections through direct bonding interfaces.
2Reliability
If the acoustic resonator is hermetically sealed in a package, then protection and stability are provided, but electrical connection to external circuitry requires leads that cause signal degradation
Solution Approach 1:
The patent extracts the harmful interconnect leads from the system by eliminating them entirely. The hermetically sealed package is maintained for protection, but the electrical connection path is reconfigured to bond the resonator directly to the circuit board, removing the leads that cause signal loss and energy degradation.
3Ease of manufacture
If separate substrates are used for acoustic devices and electronic circuitry, then manufacturing compatibility is achieved, but electrical connection requires external leads that increase noise and interference
Solution Approach 1:
The patent merges the separately manufactured acoustic resonator and electronic circuit board into a single integrated assembly. The resonator is bonded directly to the circuit board, combining two previously separate components into one unified structure that eliminates external leads and reduces noise and interference while maintaining manufacturing compatibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the performance of devices by reducing signal loss and noise, improving the coupling between acoustic resonators and electronic circuitry, leading to more reliable and efficient operation.
Implementation Method 1
bonding the base substrate to the cap substrate to define a hermetically sealed volume between the cap substrate and the base substrate
Implementation Method 2
the material layer region comprises a material having a substantially lower resistivity than the cap substrate
Implementation Method 3
the cap substrate defining a through hole therein positioned over the first bonding pad, the through hole providing access for an electrical connection to the first bonding pad
Implementation Method 4
an acoustic resonator provided on the base substrate
Data Source
AI summary
A device includes: a base substrate having a bonding pad and a peripheral pad, the peripheral pad encompassing the bonding pad; an acoustic resonator on the base substrate; a cap substrate having a bonding pad seal and a peripheral pad seal, the bonding pad seal bonding around the perimeter of the bonding pad and the peripheral pad seal bonding with the peripheral pad to define a hermetically sealed volume between the cap substrate and the base substrate, the cap substrate having a through hole therein over the bonding pad providing access for a connection to the bonding pad; a low-resistivity material layer region disposed on a portion of a surface of the cap substrate disposed inside the hermetically sealed volume, the material layer region being isolated from the bonding pad seal; and electronic circuitry disposed in the material layer region and electrical connected with the acoustic resonator.