Acoustic Scanning for Electronic Device Defect Detection
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Solution Overview
Problem
Current defect detection techniques for integrated circuits and electronic devices are complex, time-consuming, and costly, and struggle to identify latent defects effectively, often requiring extensive failure analysis and reliability testing.
Innovation Solution
A method utilizing power spectrum analysis (PSA) to visualize spatial anomalies in devices by applying a stimulus waveform and monitoring responses at multiple grid points, with the aid of principal component analysis (PCA) to characterize and display the data as images, enabling the identification of physical locations of anomalous responses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional electrical, optical, and thermal testing techniques are used to detect defects in ICs, then defect detection capability is improved, but device complexity and testing time increase significantly
Solution Approach 1:
The patent replaces complex electrical, optical, and thermal testing systems with a simplified acoustic-based testing system. By using acoustic waves to probe the device under test and analyzing the reflected or transmitted acoustic signals, the system achieves effective defect detection without requiring the complex infrastructure of conventional testing methods.
2Measurement precision
If reliability testing with high voltage and high temperature is applied to detect latent defects, then defect detection accuracy is improved, but testing time and production cost increase significantly
Solution Approach 1:
The patent replaces time-consuming high voltage and high temperature reliability testing with acoustic-based testing. By using acoustic waves to interact with the device structure and analyzing the response signals, the system can detect latent defects such as bonding wire defects and internal cracks without subjecting the device to extreme electrical or thermal conditions for extended periods.
3Measurement precision
If extensive failure analysis is performed to identify defects in ICs with millions of transistors, then defect identification accuracy is improved, but analysis time and cost increase significantly
Solution Approach 1:
The patent extracts and isolates the acoustic response signals from specific regions of the device under test. By using acoustic waves that interact with particular structural features and analyzing the localized response, the system can identify defect locations without requiring comprehensive analysis of the entire complex circuit, thereby reducing analysis time while maintaining accuracy.
4Measurement precision
If conventional screening techniques are used to detect defects in ICs, then defect detection capability is improved, but discrimination among different anomalies and spatial localization capability deteriorate
Solution Approach 1:
The patent segments the device under test into multiple regions by using acoustic waves that can be focused or directed at different locations. By scanning across the device surface or using arrays of acoustic transducers, the system obtains spatially resolved acoustic responses from different regions, enabling both defect detection and spatial localization of anomalies.
Solution Approach 2:
The patent adds a spatial dimension to the screening process by using acoustic wave propagation characteristics. The acoustic signals provide information about the physical state and structure of the device in three-dimensional space, enabling the system to not only detect the presence of defects but also to localize them spatially and distinguish between different types of anomalies based on their acoustic signatures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for efficient and accurate detection of defects and latent anomalies, enhancing the effectiveness of screening processes by providing spatially resolved information for proper device disposition, and is applicable across various scales from discrete components to large circuit boards.
Implementation Method 1
performing a power spectrum analysis (PSA), on the monitored output for each of the multiple grid points
Data Source
AI summary
A visualization method for screening electronic devices is provided. In accordance with the disclosed method, a probe is applied to a grid of multiple points on the circuit, and an output produced by the circuit in response to the stimulus waveform is monitored for each of multiple grid points where the probe is applied. A power spectrum analysis (PSA) produces a power spectrum amplitude, in each of one or more frequency bins, on the monitored output for each of the multiple grid points. The PSA provides a respective pixel value for each of the multiple grid points. An image is displayed, in which image portions representing the multiple grid points are displayed with the respective pixel values.