Acoustic-Assisted Sintering for Semiconductor Chip Bonding
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Solution Overview
Problem
The existing methods for producing sintered connections between semiconductor chips and metal layers are time-intensive and risk chip breakage due to high pressing pressures and can alter the electrical properties of the chip with high sintering temperatures, while also requiring longer processing times.
Innovation Solution
A method involving a bonding medium with metal powder that is sintered under controlled pressure and temperature conditions, with the introduction of a sound signal to reduce sintering time and enhance connection stability, using a pressing-pressure range above a minimum and temperature above a minimum, ensuring the bonding medium extends through the chip and metal layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If the pressing pressure is increased to reduce sintering time, then the sintering time is reduced, but the risk of chip breakage increases
Solution Approach 1:
The patent introduces acoustic vibrations (sound waves) into the bonding medium during the sintering process. These vibrations agitate the metal powder particles, enhancing their mobility and promoting sintering at lower pressing pressures, thereby reducing chip breakage risk while maintaining or reducing sintering time
Solution Approach 2:
The patent changes the physical state of the bonding medium by introducing acoustic energy, transforming it from a static to a dynamically vibrating state. This parameter change enables effective sintering under reduced mechanical pressure conditions
2Loss of time
If the sintering temperature is increased to reduce sintering time, then the sintering time is reduced, but the electrical properties of the semiconductor chip are significantly changed
Solution Approach 1:
Acoustic vibrations are introduced to provide energy for sintering through particle agitation and enhanced diffusion, enabling the process to proceed at lower temperatures where semiconductor chip electrical properties remain stable
Solution Approach 2:
The patent partially replaces thermal energy with acoustic energy as the driving force for sintering. The acoustic field provides the necessary energy to overcome particle resistance and promote bonding without requiring high thermal temperatures that would affect chip electronics
3Device complexity
If conventional sintering processes are used without sound signal, then the process is simple, but the sintering time is significantly longer
Solution Approach 1:
A sound generator is integrated into the sintering apparatus to produce acoustic vibrations that are transmitted into the bonding medium. This additional component enables significantly reduced sintering times by enhancing particle mobility and bonding kinetics through vibrational energy
Solution Approach 2:
The acoustic vibrations are applied continuously throughout the sintering process, maintaining constant particle agitation and energy input to accelerate the sintering kinetics and reduce overall process time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly reduces sintering time while maintaining thermal stability and mechanical integrity, preventing chip breakage and preserving electrical properties, resulting in a secure and efficient material-bonding connection.
Implementation Method 1
a sound signal is introduced into the bonding medium
Implementation Method 2
the bonding medium is kept in a temperature range that lies above a minimum temperature
Implementation Method 3
the metal powder is sintered in a sintering process
Data Source
AI summary
A method for producing a material-bonding connection between a semiconductor chip and a metal layer is disclosed. For this purpose, a semiconductor chip, a metal layer, which has a chip mounting portion, and also a bonding medium containing a metal powder are provided. The metal powder is sintered in a sintering process. In this case, throughout a prescribed sintering time, the prescribed requirements are met, that the bonding medium is arranged between the semiconductor chip and the metal layer and extends right through from the semiconductor chip to the metal layer, that the semiconductor chip and the metal layer are pressed against one another in a pressing-pressure range that lies above a minimum pressing pressure, that the bonding medium is kept in a temperature range that lies above a minimum temperature and that a sound signal is introduced into the bonding medium.