Acoustic Substrate Position Confirmation in Semiconductor Loaders
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Solution Overview
Problem
In substrate processing systems, accurately confirming the delivery position of substrates within carriers is challenging due to variations in wafer positioning and potential misalignment of mapping arms, leading to inefficient substrate handling and potential interference.
Innovation Solution
A substrate transporting apparatus that uses a receiving device with a sound collecting microphone or vibration detection sensor to confirm the delivery position by generating contact sounds or vibrations at multiple points, allowing for precise determination of the substrate's position based on movement and contact data.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a mapping arm with optical sensor is used to confirm wafer position, then delivery position can be confirmed, but the system becomes complex and requires visual verification
Solution Approach 1:
The patent replaces the optical sensor-based mapping arm system with a sound-based detection system. A sound collector detects contact sounds generated when the transportation arm touches the wafer, eliminating the need for complex optical sensors and visual verification mechanisms while maintaining position confirmation accuracy
Solution Approach 2:
The system uses the wafer itself to generate the detection signal. When the transportation arm contacts the wafer, the wafer naturally produces contact sounds that are detected by the sound collector, eliminating the need for external verification systems
2Measurement precision
If visual verification is used to confirm substrate position, then accurate delivery can be achieved, but handling time increases and throughput decreases
Solution Approach 1:
The patent replaces visual verification processes with acoustic detection. The sound collector automatically detects contact sounds to confirm substrate position, eliminating the need for visual inspection and significantly reducing handling time while maintaining position accuracy
Solution Approach 2:
The sound detection process occurs continuously and automatically during the substrate handling operation itself, rather than requiring separate verification steps. This maintains continuous workflow and improves throughput
3Measurement precision
If mapping arm is misaligned or wafer positioning varies, then delivery accuracy decreases, but using more complex alignment systems increases device complexity
Solution Approach 1:
The sound-based system automatically adapts to position variations by detecting the actual contact point through acoustic signals. The system uses the substrate itself to provide position information through contact sounds, eliminating the need for pre-alignment or complex adaptation mechanisms
Solution Approach 2:
The sound collector provides immediate feedback about contact occurrence and position. This acoustic feedback allows the system to automatically adjust and confirm the actual delivery position without requiring pre-established alignment references
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures accurate confirmation and smooth delivery of substrates by eliminating the need for visual verification and minimizing unnecessary movement, thereby improving handling efficiency and throughput.
Implementation Method 1
a sound collecting microphone or vibration detection sensor to confirm the delivery position by generating contact sounds or vibrations at multiple points
Implementation Method 2
a sound collecting microphone or vibration detection sensor to confirm the delivery position by generating contact sounds or vibrations at multiple points
Data Source
AI summary
A loader module of a substrate processing system includes a transportation arm configured to move towards a wafer accommodated in a carrier and receive the wafer, and a control unit configured to confirm a delivery position of the wafer based on an upward movement amount of an end effector of the transportation arm, and a contact sound generated when the end effector comes in contact with the wafer. The control unit confirms the delivery position of the wafer based on an average height of the end effector when the contact sound of each pad of the end effector comes in contact with the wafer to generate a contact sound a plurality of times.