Acoustic Transducer Arrangement With Parallel Connecting Elements
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Solution Overview
Problem
Ultrasonic transducers are vulnerable to external mechanical and electrical influences due to inadequate decoupling and protection in existing designs.
Innovation Solution
A sound transducer arrangement featuring a perforated plate carrier with parallel webs and a cover layer, where piezo elements are decoupled through connecting regions and partially filled with damping material, providing effective shielding and protection from external influences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If piezoelectric elements are arranged in through-holes of a perforated plate carrier, then the transducer structure is compact and integrated, but the individual transducers are exposed to external mechanical and electrical influences
Solution Approach 1:
The piezoelectric elements are nested within through-holes of the perforated plate carrier, creating a compact integrated structure. The protective layer is then nested over the entire assembly, providing shielding while maintaining the space-efficient nested configuration.
Solution Approach 2:
A protective layer is introduced as an additional component that shields the piezoelectric elements from external influences. This protective layer can be a sacrificial or replaceable element that protects the sensitive piezoelectric materials from mechanical and electrical damage.
2Reliability
If parallel webs are added to the perforated plate carrier to decouple transducers, then mechanical decoupling is improved, but the device complexity increases
Solution Approach 1:
The perforated plate carrier is segmented by adding parallel webs that divide the structure into separate regions. These webs act as mechanical barriers that decouple the piezoelectric elements, preventing stress and mechanical influences from transferring between adjacent transducers.
3Object-affected harmful factors
If the protective layer is connected to both the piezoelectric elements and the perforated plate carrier, then shielding effectiveness is improved, but the assembly complexity increases
Solution Approach 1:
The protective layer is merged with both the piezoelectric elements and the perforated plate carrier through direct connections. This merging creates a unified protective structure that provides comprehensive shielding while eliminating the need for separate mounting mechanisms.
Solution Approach 2:
The protective layer serves multiple functions: it provides mechanical protection, electrical shielding, and structural support. By making the protective layer multi-functional, the design reduces the need for additional specialized components, thereby managing complexity while maintaining protection effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively decouples and shields individual transducers from external influences, enhancing their durability and performance by reducing exposure to mechanical and electrical stress.
Implementation Method 1
several piezoelectric elements (104), each having a first electrode (105) and a second electrode (106)
Implementation Method 2
partially filling the through-holes with a damping material
Implementation Method 3
the first connection area comprises a weld seam or an adhesive layer
Data Source
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AI summary
An acoustic transducer arrangement (100) comprising: a perforated plate carrier (101) having a plurality of through-holes (111); a plurality of piezoelectric elements (104), each piezoelectric element (104) having a first electrode (105) and a second electrode (106), the first electrode (105) being opposite the second electrode (106) and a piezoelectric element (104) being provided within each through-hole (111); and a top layer (103), the top layer (103) being provided above the perforated plate carrier (101) and the piezoelectric elements (104), wherein the second electrodes (106) of the piezoelectric elements (104) are connected in an electrically conductive manner to the top layer (103), characterized in that the perforated plate carrier (101) has at least two parallel, spaced connecting elements (102, 117) laterally between two through-holes (111) and the top layer (103) has first connecting regions (108) with the connecting elements (102) which are directly adjacent to the through-hole (111).