Acoustic Wave Transducer Post Layout for Faster Transfer Printing
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Solution Overview
Problem
Conventional methods of transfer printing require multiple transfers between a source wafer and a destination substrate, increasing fabrication time and reducing manufacturing throughput.
Innovation Solution
The use of patterned substrates with substrate posts for selective printing of components, where a transfer device picks up components from a source wafer and adheres them to the substrate posts on the destination substrate, allowing for multiple print steps without intervening pickup steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional transfer printing methods are used with multiple transfers between source wafer and destination substrate, then components can be populated on the destination substrate, but fabrication time increases and manufacturing throughput decreases
Solution Approach 1:
The invention pre-arranges multiple sets of components on the source wafer in advance, organized in groups that correspond to different regions of the destination substrate. This preliminary organization allows the transfer stamp to pick up multiple component sets simultaneously and deposit them at different locations on the destination substrate in a single transfer operation, eliminating the need for repeated pickup cycles and significantly reducing fabrication time while maintaining high manufacturing throughput
2Ease of manufacture
If multiple pickup steps are performed to populate different areas of the destination substrate, then all components can be transferred, but the process complexity and fabrication time increase
Solution Approach 1:
The invention merges multiple transfer operations into a single unified process. By organizing components into groups on the source wafer that correspond to different destination regions, and using a transfer stamp with multiple posts that can simultaneously pick up and deposit multiple component sets, the process combines what would otherwise require sequential operations into one parallel transfer step, simplifying the manufacturing process and reducing fabrication time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances manufacturing throughput by enabling multiple component print steps on a substrate without the need for frequent pickups from the source wafer, improving efficiency in populating large destination substrates with components.
Implementation Method 1
picking up the components from the component source wafer by adhering the components to the stamp
Implementation Method 2
printing one or more of the picked-up components to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts
Data Source
AI summary
A device structure comprises an acoustic wave transducer comprising a component. The component comprises a piezo-electric material. Component electrodes are disposed on the component and connection posts extend away from the component. Each of the connection posts is electrically connected to one of the component electrodes. The component has a center and a length greater than a width and, for at least one pair of the connection posts, a distance between the connection posts and the center is less than one quarter of the length.