Acoustic Wave Device Columnar Electrode Void Reduction

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Solution Overview

Problem

Existing acoustic wave devices, such as SAW devices, face issues with reliability due to void formation around columnar electrodes and weak bonding between the protective cover and substrate, leading to increased breakage and connection failures during mounting and usage.

Innovation Solution

The acoustic wave device features a substrate with an acoustic wave element, an outside connection conductor, and a protective cover that surrounds the columnar electrode, reducing void formation and enhancing the contact area and bonding force between the substrate and the protective cover, thereby improving the device's reliability and sealing capabilities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If sealing resin is molded around columnar electrodes to prevent breakage, then electrode protection is improved, but voids form around the electrodes reducing support strength

Engineering Contradiction:
Improveelectrode protectionVSAvoidconnection reliability
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The protective cover is formed beforehand to define the vibration space and provide structural support. The frame member is preliminarily shaped to surround the columnar electrodes, creating a supportive framework before the sealing resin is applied. This preliminary structure prevents void formation and ensures proper resin distribution around the electrodes.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The protective cover acts as an intermediary structure between the columnar electrodes and the external environment. The frame member specifically serves as a mediator that provides mechanical support to the electrodes while allowing the sealing resin to properly bond and fill the spaces, eliminating voids and ensuring reliable electrical connections.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Strength

If protective cover is added to secure vibration space, then acoustic wave element protection is improved, but bonding force between cover and substrate remains weak

Engineering Contradiction:
Improvevibration space sealingVSAvoidbonding force
Core Design Contradiction:
StrengthVSForce

Solution Approach 1:

The frame member is designed with varying cross-sectional dimensions, being wider at the bottom portion that contacts the substrate and narrower at the top portion. This local quality variation ensures strong bonding at the critical substrate interface while maintaining the protective enclosure function at the upper sections. The frame member's geometry is optimized locally to maximize bonding strength where it matters most.

Inventive Principle:
Principle #3Local quality

3Volume of moving object

If device size is reduced for surface mount applications, then mounting density is improved, but structural integrity and sealing reliability deteriorate

Engineering Contradiction:
Improvedevice sizeVSAvoidsealing reliability
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The protective cover structure is nested within the overall device footprint, with the frame member efficiently enclosing the vibration space and columnar electrodes in a compact arrangement. The lid member closes the top opening, creating a nested, space-efficient structure that maintains robust sealing and structural integrity while minimizing the device's overall volume for surface mount applications.

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces the likelihood of columnar electrode breakage and maintains a stable, tight seal, resulting in a small-sized and highly reliable acoustic wave device.

Implementation Method 1

a surface acoustic wave (hereinafter, sometimes abbreviated as 'SAW') device

Methodology Applied
Scientific EffectSurface acoustic wave: Surface Acoustic Wave

Implementation Method 2

SAW element 2 on one main surface of the piezoelectric substrate 1

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS8384272B2Acoustic wave device and method for production of same
Publication Date: 2013.02.26 KYOCERA CORP
  • US8384272B2 patent drawing
  • US8384272B2 patent drawing
  • US8384272B2 patent drawing

AI summary

A small and highly reliable acoustic wave device and a method for production of the same will be provided. The acoustic wave device has a piezoelectric substrate 1; a SAW element 2 on one main surface of the piezoelectric substrate 1; an outside connection-use conductor 3 formed on the one main surface of the piezoelectric substrate 1 and electrically connected to the SAW element 2; a columnar electrode 10 on the outside connection-use conductor 3; and a protective cover 6 defining inner walls of a vibration space 7 for vibration of the SAW element 2 and planarly surrounding a side surface of the columnar electrode 10.