Acoustic Wave Device Wiring Layer Direct Bonding
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Solution Overview
Problem
Existing methods for reducing the size and height of acoustic wave devices compromise the bondability of bumps, making it difficult to miniaturize these devices effectively.
Innovation Solution
The acoustic wave device design includes a mounting substrate with a first wiring layer and an element substrate with a second wiring layer, where both layers have bond regions and connection regions of equal thickness, allowing for direct bonding and eliminating the need for bumps, thereby reducing the device size without sacrificing bondability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the bump size is reduced to minimize device size and height, then the device dimensions are improved, but the bondability of the bump deteriorates
Solution Approach 1:
The patent extracts and eliminates the bump structure from the packaging system. Instead of using traditional bumps for electrical connection and bonding, the invention directly bonds the element substrate to the mounting substrate through aligned wiring layers, removing the intermediate bump component that limited miniaturization while compromising bondability.
Solution Approach 2:
The patent merges the electrical connection function and the mechanical bonding function into a single integrated wiring layer structure. The first and second wiring layers serve both as electrical conduits and as bonding interfaces, eliminating the need for separate bump structures and enabling simultaneous optimization of both connection reliability and device compactness.
2Reliability
If traditional bump structures are used for packaging, then bondability is maintained, but device size and height increase
Solution Approach 1:
The patent removes the bump structure from the packaging system entirely. The wiring layers are designed to extend and align directly between the element substrate and mounting substrate, eliminating the need for raised bump structures and thereby reducing device height and overall size while maintaining bonding capability through the wiring layer interface.
Solution Approach 2:
The patent transitions from a vertical bump-based connection approach to a planar wiring layer alignment approach. By extending the wiring layers horizontally and bonding them in aligned regions, the invention achieves electrical connection and mechanical bonding without requiring vertical height increases from bumps, thus reducing device dimensions.
Data Source
AI summary
An acoustic wave device includes: a mounting substrate; a first wiring layer located on an upper surface of the mounting substrate, the first wiring layer including a first bond region and a first connection region connecting with the first bond region and having a thickness substantially equal to a thickness of the first bond region; an element substrate mounted on the mounting substrate; an acoustic wave element located on a lower surface of the element substrate; and a second wiring layer located on the lower surface of the element substrate, the second wiring layer including a second bond region and a second connection region, the second bond region directly bonding with the first bond region of the first wiring layer, the second connection region connecting the acoustic wave element with the second bond region and having a thickness substantially equal to a thickness of the second bond region.