Acoustic Wave Filter Mounting Layout for Better Heat Dissipation
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Solution Overview
Problem
Existing acoustic wave devices with surface acoustic wave filters face insufficient heat dissipation despite the use of insulating films, as the thermal conductivity of these films may not be sufficient to manage the heat generated by the acoustic wave elements.
Innovation Solution
Incorporating a heat radiation pattern on the mounting substrate that is connected to its internal layer but not electrically connected to the bump-mounting electrode land, allowing for efficient heat dissipation through a material with superior thermal conductivity, such as metal, directly facing the functional electrodes of the acoustic wave element chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If an insulating film is provided on the mounting substrate to improve heat dissipation, then heat dissipation is improved, but the thermal conductivity is insufficient to provide adequate heat dissipation
Solution Approach 1:
The patent changes the material parameter of the thermal conduction pattern from insulating material to conductive material (such as metal), fundamentally altering the thermal conductivity parameter to achieve effective heat dissipation while maintaining electrical isolation through non-electrical connection to the electrode land
Solution Approach 2:
The patent segments the thermal management function from the electrical connection function by introducing a separate thermal conduction pattern that is spatially distinct from the electrode land, allowing independent optimization of thermal and electrical properties
2Temperature
If a heat radiation pattern is added to the mounting substrate, then heat dissipation is enhanced, but the device complexity increases
Solution Approach 1:
The mounting substrate is given multi-functionality by integrating both electrical connection function (through electrode land) and thermal dissipation function (through thermal conduction pattern) into a single component, avoiding the need for separate thermal management components and thus not increasing overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation, preventing electrode breakdown and allowing for increased output power without thermal issues, as demonstrated by improved power handling capabilities compared to devices without the heat radiation pattern.
Implementation Method 1
Heat from each acoustic wave element is dissipated through the insulating film
Data Source
AI summary
An acoustic wave device includes a mounting substrate, and an acoustic wave element chip. The mounting substrate includes a first major surface with a bump-mounting electrode land thereon, and a second major surface facing the first major surface. The acoustic wave element chip includes a piezoelectric substrate including a major surface, and a functional electrode and a bump located over the major surface of the piezoelectric substrate. The bump is joined to the bump-mounting electrode land. A heat radiation pattern is located over the first major surface of the mounting substrate and located within a region facing the functional electrode of the acoustic wave element chip. The heat radiation pattern is connected to an internal layer portion of the mounting substrate between the first and second major surfaces, and not electrically connected to the bump-mounting electrode land on the first major surface.