Acoustic Wave Inspection for Multilayer Pattern Defects
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Solution Overview
Problem
Existing inspection methods for multilayer pattern structures, especially those with optically opaque materials like metal, struggle to non-destructively detect defects in lower layers due to concealment by top layers, requiring destructive testing and prolonged time and cost for defect identification.
Innovation Solution
A chaotic wave sensor-based inspection method that irradiates waves onto a pattern structure, collects speckle data from multiple scattering, and analyzes it to detect defects in both top and underlying layers without destroying the sample, using a combination of data collectors and multiple scattering amplifiers to enhance sensitivity and accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Difficulty of detecting and measuring
If optical observation is used to inspect pattern structures, then top-layer patterns can be observed, but lower patterns are concealed by top-layer opaque materials and cannot be detected
Solution Approach 1:
The patent replaces optical observation methods with acoustic observation methods. Specifically, it uses acoustic microscopes and acoustic radiation pressure to detect defects in multilayer pattern structures. Acoustic waves can penetrate through opaque materials like metal layers, allowing non-contact detection of defects in both upper and lower layers without requiring the sample to be destroyed or separated.
Solution Approach 2:
The patent introduces acoustic waves as an intermediary medium to detect defects. Acoustic waves serve as a mediator that can penetrate through opaque materials (unlike optical waves) and carry information about defects in the pattern structure. The system uses acoustic radiation pressure and acoustic microscopy techniques to visualize and detect defects in multilayer structures without direct contact or destruction of the sample.
2Measurement precision
If destructive inspection methods are used to detect defects in lower layers, then defect detection is possible, but the sample must be cut and inspected locally, requiring time and cost
Solution Approach 1:
The patent replaces destructive mechanical inspection methods (cutting and physical examination) with non-contact acoustic observation. Acoustic waves can penetrate through the entire sample structure and provide information about defects without requiring physical disruption. This allows for rapid, non-destructive inspection of the entire sample surface, eliminating the need for time-consuming cutting and localized examination.
Solution Approach 2:
The patent enables the sample to be inspected in its original, intact state without requiring destruction or modification. The acoustic observation system allows the sample to serve itself by providing defect information through acoustic wave interaction, eliminating the need for destructive testing procedures that require sample preparation, cutting, and complex inspection setups.
3Measurement precision
If destructive inspection methods are used, then defect detection is possible, but material is wasted and cost increases
Solution Approach 1:
The patent replaces destructive inspection methods with non-contact acoustic observation. Acoustic waves interact with the sample without causing physical damage or material loss. This allows complete defect detection in the original sample, eliminating the need to destroy or waste material during inspection procedures.
Solution Approach 2:
The sample can be inspected in its intact state without requiring destruction or material sacrifice. The acoustic observation system allows the sample to remain undamaged while providing comprehensive defect information, thereby preventing material waste and reducing inspection costs.
4Measurement precision
If via defects are detected using electrical tests after manufacturing, then defect identification is possible, but the process is delayed and time is consumed
Solution Approach 1:
The patent enables defect detection during the manufacturing process itself, before final assembly and electrical testing. By using acoustic observation to detect via defects in real-time during fabrication, the system identifies problems early when they can be corrected without delaying subsequent manufacturing steps. This preliminary detection capability eliminates the need for time-consuming post-manufacturing electrical tests.
Solution Approach 2:
The patent replaces electrical testing with acoustic observation for defect detection. Acoustic waves can detect via defects non-contact and in real-time during manufacturing, eliminating the need for subsequent electrical testing. This substitution speeds up the inspection process and allows for immediate feedback during fabrication, improving manufacturing throughput.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid, non-destructive detection of defects in multilayer pattern structures, reducing inspection time and cost by analyzing speckle patterns to identify abnormalities in both top and hidden layers, improving detection efficiency and reducing material waste.
Implementation Method 1
irradiating a wave from a wave source onto a sample including a pattern region in which a structure having a certain pattern is provided on a substrate, collecting speckle data generated due to multiple scattering of the wave in the pattern region
Implementation Method 2
collecting speckle data generated due to multiple scattering of the wave in the pattern region
Data Source
AI summary
According to an aspect of the present invention, there is provided a pattern structure inspection method including irradiating a wave from a wave source onto a sample including a pattern region in which a structure having a certain pattern is provided on a substrate, collecting speckle data generated due to multiple scattering of the wave in the pattern region, by using a data collector, and analyzing whether the structure of the pattern region has a defect, by comparing the collected speckle data to reference speckle data.