Acoustic Wave Device Laser-Altered Substrate Cutting
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Solution Overview
Problem
The manufacturing of acoustic wave devices with piezoelectric substrates joined to supporting substrates often results in chipping and cracking due to low flexural strength, as existing methods fail to effectively manage the cutting process without causing damage.
Innovation Solution
A method involving the formation of altered domains in the supporting substrate using laser light, followed by the creation of grooves on the piezoelectric substrate to overlap with these domains, allowing precise cutting that minimizes chipping and cracking by ensuring the piezoelectric substrate remains at the bottom of the grooves, thereby controlling the cutting process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the joined substrate is cut using conventional methods, then the acoustic wave device can be divided into chips, but chipping and cracking occur due to low flexural strength
Solution Approach 1:
The method performs preliminary actions by forming an altered domain in the supporting substrate and creating a groove on the piezoelectric substrate before cutting. This preparation work strengthens the substrate structure in advance, preventing chipping and cracking during the subsequent cutting process while enabling efficient chip division.
2Volume of moving object
If the piezoelectric substrate is made thinner to reduce device size, then the device becomes more compact, but the flexural strength decreases further causing more chipping
Solution Approach 1:
The method applies local quality by creating a groove specifically at the region where the piezoelectric substrate needs to be separated, while the rest of the substrate maintains its original structure. This localized modification allows thin substrates to be cut without chipping, as the groove provides a controlled separation path that does not compromise the overall structural integrity.
3Ease of manufacture
If conventional cutting methods are used on joined substrates, then the cutting process is simple and fast, but the cutting precision deteriorates due to substrate overlap
Solution Approach 1:
The groove acts as an intermediary structure between the piezoelectric substrate and the supporting substrate during cutting. It provides a controlled separation path that prevents substrate overlap, ensuring precise cutting. The altered domain in the supporting substrate serves as another intermediary that guides the cutting process and maintains accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces chipping and cracking incidence, enhancing the flexural strength of the acoustic wave devices and ensuring clean separation without substrate overlap, resulting in improved device integrity and performance.
Implementation Method 1
forming an altered domain in a supporting substrate by irradiating the supporting substrate with a laser light
Data Source
AI summary
A method for manufacturing an acoustic wave device includes: forming an altered domain in a supporting substrate by irradiating the supporting substrate with a laser light, a piezoelectric substrate being joined to an upper surface of the supporting substrate; forming a groove on an upper surface of the piezoelectric substrate so as to overlap with the altered domain; and cutting the supporting substrate at the groove.