Acoustic Wave Structure With Reinforcing Lid for Through-Hole Strength
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Acoustic wave devices with through holes in piezoelectric layers face reduced mechanical strength, which affects their performance and reliability.
Innovation Solution
Incorporating a reinforcing lid portion on the piezoelectric layer to close the through holes, enhancing the mechanical strength by using a material like photosensitive resin or other suitable materials to form a lid that covers the holes, thereby preventing crack formation and improving structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a through hole is formed in the piezoelectric layer, then the hollow portion can be formed in the support, but the mechanical strength around the through hole is reduced
Solution Approach 1:
The patent applies local quality by adding a reinforcing lid portion specifically at the through hole location rather than uniformly reinforcing the entire piezoelectric layer. This localized reinforcement restores mechanical strength at the critical through hole area while preserving the hollow portion structure and not adding unnecessary material elsewhere.
Solution Approach 2:
The patent uses composite materials by combining the piezoelectric layer with a reinforcing lid portion made of different material properties. The lid portion is formed from a material that provides enhanced mechanical strength and is bonded to the piezoelectric layer, creating a composite structure that maintains both the hollow portion functionality and structural integrity.
2Ease of manufacture
If a through hole is formed in the piezoelectric layer, then the hollow portion can be formed in the support, but cracks may form around the through hole
Solution Approach 1:
The reinforcing lid portion is locally applied at the through hole location to prevent crack formation. This localized reinforcement provides structural support exactly where stress concentration occurs, preventing cracks without adding complexity to the entire device structure.
Solution Approach 2:
The reinforcing lid portion acts as a preventive measure by being formed in advance to close the through hole and provide structural support before operational stresses can cause crack formation. This prior cushioning approach prevents reliability issues before they occur.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves the mechanical strength of the piezoelectric layer, reducing the likelihood of cracks and enhancing the overall performance and reliability of the acoustic wave devices.
Implementation Method 1
an acoustic wave device includes a piezoelectric layer
Data Source
AI summary
An acoustic wave device includes a piezoelectric layer that includes a first main surface and a second main surface opposite to the first main surface, a functional electrode on the piezoelectric layer, and a support on the second main surface of the piezoelectric layer and including a support substrate. The support includes a hollow portion overlapping at least a portion of the functional electrode in plan view in a lamination direction of the support and the piezoelectric layer. A through hole communicating with the hollow portion is provided in the piezoelectric layer. The first main surface of the piezoelectric layer includes a reinforcing lid portion to close the through hole.