Acoustic Wave Package Sealing for Side Wiring Durability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Acoustic wave devices with extended wiring lines on side surfaces are prone to breaking when subjected to external forces due to the rigidity of the sealing resin, which does not effectively absorb or distribute the applied force.
Innovation Solution
Incorporating a second resin portion with a lower Young's modulus than the primary sealing resin between the extended wiring lines and the first resin portion, and optionally a third resin portion at corner areas, to reduce the force applied to the wiring lines and prevent breakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a sealing resin with high rigidity is used to seal the acoustic wave device, then the sealing performance and structural strength are improved, but the extended wiring lines on the side surface are more prone to breaking when external force is applied
Solution Approach 1:
The patent applies local quality by using two different resin materials with different properties in different regions. The first resin material (higher rigidity) is used for the sealing portion where strong bonding and sealing performance are required, while the second resin material (lower rigidity) is used for the protective portion covering the extended wiring lines where flexibility and shock absorption are needed. This local differentiation resolves the contradiction between sealing strength and wiring line durability.
Solution Approach 2:
The patent uses composite materials by combining two different resin materials with distinct mechanical properties. The first resin material has higher rigidity for effective sealing, while the second resin material has lower rigidity to provide cushioning protection. This composite approach allows the device to simultaneously achieve both strong sealing performance and protection against wiring line breakage under external force.
2Ease of manufacture
If the sealing resin directly contacts the extended wiring line, then the manufacturing process is simplified, but the wiring line is more susceptible to damage from external forces
Solution Approach 1:
The patent introduces an intermediary element - the second resin material with lower rigidity - that acts as a mediator between the extended wiring line and the external environment. This intermediary resin layer absorbs and distributes external forces, preventing direct transmission of harmful forces to the wiring line, while still allowing the first resin material to provide sealing functionality.
Solution Approach 2:
The patent applies beforehand cushioning by placing the second resin material (softer, lower rigidity) over the extended wiring lines before final sealing. This softer resin layer serves as a pre-established cushioning layer that absorbs external impacts and protects the wiring lines from damage before any external force is applied to the device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents breaks in the extended wiring lines by distributing external forces more evenly, enhancing the durability and reliability of the acoustic wave device.
Implementation Method 1
The second resin portion has a lower Young's modulus than the first resin portion
Data Source
AI summary
An acoustic wave device includes an element substrate having piezoelectricity, a functional electrode on a first main surface of the element substrate, an extended wiring line electrically connected to the functional electrode and extending from the first main surface to a side surface of the element substrate, an external terminal electrically connected to the extended wiring line and on a second main surface of the element substrate, a first resin portion to seal the acoustic wave device, and a second resin portion at least between the extended wiring line on the side surface and the first resin portion. The second resin portion has a lower Young's modulus than the first resin portion.