Acoustic Wave Resonator Piezoelectric Layer Thickness Control

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Solution Overview

Problem

Surface acoustic wave devices with laminated structures of high and low acoustic velocity films and a piezoelectric film suffer from high-order mode generation in higher frequency bands, which changes with temperature, leading to ripple effects in pass bands, particularly in high-frequency side filters connected to antennas.

Innovation Solution

The acoustic wave device incorporates a series of acoustic wave resonators with a piezoelectric layer, an IDT electrode, and a high acoustic velocity member, where the thickness of the piezoelectric layer is limited to 3.5λ or less, and includes a dielectric film between the piezoelectric layer and the IDT electrode in some resonators, while others do not, to manage the cut-angle and mass per unit length of electrode fingers, reducing temperature-induced frequency changes of high-order modes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a laminated structure of high acoustic velocity film, low acoustic velocity film, and piezoelectric film is used to increase Q factor, then the Q factor is improved, but high-order modes are generated in higher frequency bands that change with temperature causing ripple in pass bands

Engineering Contradiction:
ImproveQ factorVSAvoidfrequency stability of high-order modes
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent changes the thickness parameter of the piezoelectric layer to 3.5λ or less, which fundamentally alters the acoustic wave propagation characteristics and eliminates the generation of high-order modes that are sensitive to temperature changes, thereby resolving the frequency stability issue while maintaining the Q factor benefit

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent extracts or removes the problematic high-order modes by controlling the piezoelectric layer thickness to 3.5λ or less, preventing these modes from being generated in the first place, thus eliminating the temperature-induced frequency drift and ripple effects in the pass bands

Inventive Principle:
Principle #2Taking out (Extraction)

2Reliability

If the piezoelectric layer thickness is increased to improve Q factor, then the Q factor is improved, but high-order modes are generated that deteriorate pass band characteristics

Engineering Contradiction:
ImproveQ factorVSAvoidpass band characteristics
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent establishes a critical threshold parameter for the piezoelectric layer thickness (3.5λ or less) that simultaneously optimizes both Q factor and pass band characteristics by preventing high-order mode generation, thus resolving the contradiction between improving Q factor and maintaining manufacturing precision

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly reduces or prevents the deterioration of pass band characteristics and high-order mode changes due to temperature, enhancing the stability and performance of acoustic wave devices, multiplexers, and communication devices by minimizing frequency fluctuations.

Implementation Method 1

Each of the first acoustic wave resonator and the second acoustic wave resonator includes a piezoelectric layer, an interdigital transducer (IDT) electrode

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Implementation Method 2

In the high acoustic velocity member, an acoustic velocity of a bulk wave propagating through is higher than an acoustic velocity of an acoustic wave propagating through the piezoelectric layer

Methodology Applied
Scientific EffectAcoustic wave propagation: Sound

Data Source

PatentUS11496226B2Acoustic wave device, multiplexer, high-frequency front end circuit, and communication device
Publication Date: 2022.11.08 MURATA MFG CO LTD
  • US11496226B2 patent drawing
  • US11496226B2 patent drawing
  • US11496226B2 patent drawing

AI summary

In an acoustic wave device, an antenna end resonator that is electrically closest to a first terminal is a first acoustic wave resonator. In each of the first acoustic wave resonator and a second acoustic wave resonator, a thickness of a piezoelectric layer is about 3.5λ or less when a wavelength of an acoustic wave is denoted as λ. The first acoustic wave resonator and the second acoustic wave resonator satisfy at least one of a first condition, a second condition, and a third condition. The first condition is a condition that the first acoustic wave resonator further includes a dielectric film provided between the piezoelectric layer and an interdigital transducer electrode, and the second acoustic wave resonator does not include the dielectric film.