Acoustic Wave Shielding Layout for Internal Noise Isolation
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Solution Overview
Problem
Noise interference between electronic components in compact electronic devices, such as smartphones, is exacerbated by the exposure of wires for both ground and signal applications, leading to improper operation of semiconductor dies like surface acoustic wave filters.
Innovation Solution
An acoustic wave device design that electrically connects the ground pad wire to a first shield film covering the side surfaces, while isolating signal pad wires, using a first insulating film and a first shield film to suppress noise interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the first shield film is connected to the GND potential to suppress noise interference, then the noise suppression effect is improved, but the signal wire is also connected to the GND potential causing the semiconductor die to malfunction
Solution Approach 1:
The patent segments the electrical connection paths by creating separate connection points for the shield film. The first shield film is connected to GND through the ground pad wire at a first end, while the second shield film is connected to GND through the ground pad wire at a second end, preventing signal wire interference while maintaining noise suppression
Solution Approach 2:
The ground pad wire acts as an intermediary element that provides separate connection points for the first and second shield films. By using the ground pad wire as a mediator with multiple connection points, the patent enables the shield films to be connected to GND without creating unwanted signal paths
2Reliability
If the first shield film is not connected to the GND potential to avoid signal interference, then the operation correctness is maintained, but the noise suppression effect becomes lower
Solution Approach 1:
The patent merges the first shield film and second shield film into a unified shielding system that is collectively connected to the ground pad wire. This combined shielding structure provides comprehensive noise suppression while maintaining proper signal isolation through the coordinated GND connection
Data Source
AI summary
An acoustic wave device that can correctly perform an operation as the acoustic wave device and can achieve suppression of internal noise interference, a method of manufacturing the same, and a module are provided. The acoustic wave device includes a base member provided with a plurality of side surfaces, a ground pad wire, and a first shield film that covers the plurality of side surfaces. Since the ground pad wire and the first shield film are electrically connected to each other, operation as the acoustic wave device can correctly be performed and internal noise interference can be suppressed.