Acoustic Wave Device Shielding Member for Electromagnetic Interference
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Solution Overview
Problem
Acoustic wave devices, such as band pass filters, face challenges in effectively blocking electromagnetic waves while maintaining device functionality and efficiency, particularly in communications devices where signal filtering is critical.
Innovation Solution
Incorporating a shielding member electrically connected to a ground pad and formed of conductive material, which encloses the acoustic wave generator, effectively blocks electromagnetic waves by serving as both a protective and shielding component, thereby preventing interference and enhancing device performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If additional shielding layers are added to block electromagnetic waves, then shielding capability is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines the shielding function with the substrate by forming a conductive shielding layer directly on the substrate surface. This merging of functions eliminates the need for separate shielding components, thereby blocking electromagnetic waves while maintaining simple device structure and reducing manufacturing complexity
Solution Approach 2:
The substrate is designed to serve multiple functions: it provides mechanical support for the acoustic wave device and simultaneously acts as an electromagnetic shield through the conductive shielding layer. This multi-functionality allows the substrate to block electromagnetic waves without adding extra shielding components, thus reducing overall device complexity
2Object-affected harmful factors
If additional shielding layers are added to block electromagnetic waves, then shielding capability is improved, but manufacturing cost and time increase
Solution Approach 1:
The shielding function is merged into the substrate fabrication process by depositing a conductive layer during substrate manufacturing. This integration eliminates separate shielding component production and assembly steps, thereby achieving electromagnetic wave blocking while improving manufacturing efficiency and reducing production time
Solution Approach 2:
The conductive shielding layer is formed on the substrate in advance during the substrate manufacturing process, before the acoustic wave device components are assembled. This preliminary action ensures shielding capability is built-in from the start, eliminating the need for subsequent shielding component installation and reducing overall manufacturing steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively blocks electromagnetic waves, reducing signal interference and improving the acoustic wave device's operational efficiency and reliability, while also simplifying the manufacturing process by eliminating the need for additional shielding layers.
Implementation Method 1
a shielding member electrically connected to the ground pad and blocking reception or emission of electromagnetic waves at the acoustic wave generator
Implementation Method 2
a thin film type device that generates resonance by depositing a piezoelectric dielectric material on a silicon wafer, a semiconductor substrate, and using piezoelectric characteristics thereof
Data Source
AI summary
An acoustic wave device includes a substrate comprising one surface on which an acoustic wave generator and at least one ground pad are included; a support component formed of an insulating material and disposed on the substrate along a circumference of the acoustic wave generator; and a shielding member electrically connected to the ground pad and blocking reception or emission of electromagnetic waves at the acoustic wave generator.