Acoustic Wave Resonator Thermal Bypass for High RF Power

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Solution Overview

Problem

Acoustic wave resonators in radio frequency systems face limitations due to heat management issues, leading to thermal runaway and electrical overstress when exposed to high RF power levels, which can result in damage.

Innovation Solution

Incorporating direct or capacitive coupling portions through the substrate to provide a bypass current pathway, allowing heat to be dissipated through the substrate, thereby preventing thermal runaway and electrical overstress.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If high RF power levels are applied to acoustic wave devices, then the filtering performance is improved, but thermal runaway and electrical overstress occur causing device damage

Engineering Contradiction:
ImproveRF power levelVSAvoiddevice reliability
Core Design Contradiction:
PowerVSReliability

Solution Approach 1:

The patent implements a bypass current pathway that creates negative feedback to counteract thermal runaway. When temperature increases cause thermal runaway, the bypass pathway diverts current away from the resonator, reducing power dissipation and cooling the device. This automatic feedback mechanism protects the device while allowing high RF power operation.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The patent introduces a bypass current pathway as an intermediary element between the electrodes and the resonator. This bypass pathway acts as a mediator that diverts excess current away from the resonator during thermal runaway conditions, preventing direct damage while maintaining overall device operation.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of manufacture

If conventional acoustic wave device structure is used, then manufacturing is simplified, but heat management is inadequate leading to thermal runaway

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidheat management
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

The patent integrates the bypass current pathway within the existing device structure by extending coupling portions through piezoelectric and dielectric layers to contact the substrate. This nested integration allows the bypass pathway to be incorporated without adding external components, maintaining manufacturing simplicity while improving heat management.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent addresses heat management by adding a vertical dimension to current flow - creating a third pathway dimension through the substrate that complements the horizontal signal flow between electrodes. This dimensional addition provides thermal relief without complicating the planar device structure.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The bypass current pathway effectively manages heat, preventing damage to the resonators by diverting excess power and maintaining operational stability under high power conditions.

Implementation Method 1

A surface acoustic wave resonator is arranged to generate a surface acoustic wave. BAW filters can include BAW resonators. In BAW resonators, acoustic waves propagate in a bulk of a piezoelectric layer.

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Implementation Method 2

In BAW resonators, acoustic waves propagate in a bulk of a piezoelectric layer... there remains a need for improved SAW and BAW devices and filters, such as with improved heat management... The plurality of coupling portions can be configured to provide a bypass current pathway through the substrate

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12609670B2Acoustic wave devices with thermal bypass
Publication Date: 2026.04.21 SKYWORKS SOLUTIONS INC
  • US12609670B2 patent drawing
  • US12609670B2 patent drawing
  • US12609670B2 patent drawing

AI summary

An acoustic wave device can have a plurality of coupling portions configured to electrically couple electrodes of the device to the substrate of the device to provide a bypass current pathway through the substrate for heat management. The substrate can be a semiconductor material, which can become more conductive as the temperature increases so that the bypass current pathway diverts more power through the substrate as the temperature increases. The acoustic wave device can be a surface acoustic wave device, which can have an interdigital transducer electrode that has the coupling portions on each of the bus bars and extending through the piezoelectric layer to contact the substrate. The acoustic wave device can be a bulk acoustic wave device in some implementations.