Acousto-Optic Transducer Bonding With Low-Temperature Indium

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Solution Overview

Problem

The challenge in acousto-optic devices is securing transducers to AO bases with a reliable bond that maintains mechanical stability and prevents thermal damage, while ensuring compatibility with sensitive materials and providing a hermetic seal.

Innovation Solution

A robotic system is used in a vacuum environment to apply Indium epoxy between the transducer and AO base, utilizing a robotic arm with a vacuum gripper, temperature control, dispensing system, and force/torque sensors to ensure precise bonding and curing, leveraging Indium's low-temperature bonding characteristics for strong, conductive, and hermetic connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If traditional bonding methods are used to secure transducer to AO base, then bonding strength can be achieved, but thermal damage occurs to sensitive materials

Engineering Contradiction:
Improvebonding strengthVSAvoidthermal damage
Core Design Contradiction:
StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent changes the bonding temperature parameter from traditional high-temperature bonding to low-temperature bonding (below the melting point of Indium, approximately 156°C). This parameter change allows achieving strong bonding while preventing thermal damage to sensitive AO materials such as crystals and optical elements.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent utilizes the phase transition properties of Indium, which melts at approximately 156°C. By controlling the bonding temperature to be below this melting point, the Indium remains in solid state providing mechanical bonding strength while avoiding the thermal damage that would occur at higher temperatures. The phase transition characteristic enables precise temperature control for damage-free bonding.

Inventive Principle:
Principle #36Phase transitions

2Stability of the object's composition

If high-temperature bonding is used to ensure bond strength, then mechanical stability is improved, but compatibility with sensitive materials deteriorates

Engineering Contradiction:
Improvemechanical stabilityVSAvoidmaterial compatibility
Core Design Contradiction:
Stability of the object's compositionVSAdaptability or versatility

Solution Approach 1:

The patent changes the bonding temperature parameter to low temperature, which simultaneously achieves mechanical stability through strong Indium bonding while improving material compatibility by preventing thermal damage to sensitive AO materials including crystals, semiconductors, and optical elements.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs Indium as a bonding material that forms a composite bonding interface between the transducer and AO base. This Indium-based composite bonding structure provides both mechanical stability and broad material compatibility, as Indium can bond to various materials (metals, ceramics, semiconductors) without requiring high temperatures that would damage sensitive components.

Inventive Principle:
Principle #40Composite materials

3Reliability

If conventional bonding methods are used, then bonding can be achieved, but hermetic seal is not provided

Engineering Contradiction:
Improvebonding reliabilityVSAvoidcontaminant ingress
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent uses Indium as a bonding material that inherently provides hermetic sealing properties. The Indium forms a continuous, dense bonding interface that prevents contaminant and moisture ingress, thereby improving reliability by eliminating a major failure mode in AO devices while maintaining strong mechanical bonding.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method provides a reliable, high-strength bond that is compatible with sensitive materials, prevents thermal damage, and ensures a hermetic seal, enhancing the mechanical stability and longevity of acousto-optic devices.

Implementation Method 1

a robot apparatus for securing a transducer to an AO base in a vacuum environment

Methodology Applied
Scientific EffectVacuum: Vacuum

Implementation Method 2

a temperature control system integrated into the vacuum chamber, capable of reducing the chamber's temperature

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

applying Indium epoxy onto bonding surfaces of the transducer and the AO base... Indium is a soft, malleable metal that exhibits excellent bonding characteristics at relatively low temperatures

Methodology Applied
Scientific EffectAdhesion: Adhesive

Implementation Method 4

force/torque sensors installed at the end-effector of the robotic arm system, configured to measure applied force and torque during the bonding process

Methodology Applied
Scientific EffectMechanical Force: Force

Data Source

PatentUS12009629B1Robotic system for acousto-optic transducer bonding
Publication Date: 2024.06.11 INTRAACTION CORP
  • US12009629B1 patent drawing
  • US12009629B1 patent drawing
  • US12009629B1 patent drawing

AI summary

An acousto-optic deflector includes an optical element having a surface with one or more steps formed thereon; a conductive layer formed on the surface with the steps; one or more crystals secured to each step; and electrodes positioned on each surface of each crystal.