Anisotropic Conductive Film With Copper Gold Foil Layer
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Solution Overview
Problem
Anisotropic conductive films (ACFs) face issues with poor conductivity due to double-sided adhesion and uncertain positions of scattered conductive particles during hot pressing, affecting electrical conduction between electronic components and substrates.
Innovation Solution
The ACF structure incorporates a copper/gold foil surface layer, with conductive particles enriched through vibration and magnetic attraction, and real-time conductivity detection during the curing stage to ensure effective conduction, replacing traditional electroplating and conductive tape methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the conductive particles are scattered inside the ACF during hot-pressing, then the ACF can be bonded to the metal surface, but the positions of the conductive particles become uncertain and electrical conduction is not guaranteed
Solution Approach 1:
The conductive particles are pre-aligned in the ACF before hot-pressing using a unidirectional pressing mechanism. This preliminary action ensures that the conductive particles are positioned in a specific direction (perpendicular to the ACF surface) before the bonding process, so that during hot-pressing they will effectively bridge the gap between metal surfaces and ensure reliable electrical conduction.
Solution Approach 2:
The pressing force is applied unidirectionally to create local alignment of conductive particles in the direction perpendicular to the ACF surface. This local quality enhancement ensures that particles are properly oriented at the critical bonding interface while maintaining the overall structure of the ACF.
2Reliability
If traditional electroplating method is used to form contact conduction area, then high electrical conductivity and low contact resistance are achieved, but the process becomes complicated and cost increases
Solution Approach 1:
The invention extracts the essential function of electroplating (providing conductive particles for electrical conduction) and implements it through a simpler ACF hot-pressing process. Instead of using complex electroplating equipment and multiple processing steps, the patent uses a straightforward hot-pressing method with pre-aligned conductive particles to achieve the same electrical conduction effect.
Solution Approach 2:
The invention changes the fundamental parameter of how conductivity is achieved: instead of depositing metal layers through electrochemical reactions (electroplating), the patent uses physical hot-pressing to bond ACF with pre-positioned conductive particles directly to metal surfaces, dramatically simplifying the process while maintaining electrical conductivity.
3Reliability
If conductive particles are blasted by force to achieve effective electrical conduction, then conductivity improves, but the particles are scattered and positions remain uncertain
Solution Approach 1:
Instead of blasting particles into position during the bonding process, the invention performs preliminary alignment of conductive particles in the unidirectional pressing step before hot-pressing. This ensures particles are already in the correct positions and orientations when the actual bonding occurs, eliminating the need for forceful blasting that would scatter particles.
Solution Approach 2:
The conventional approach blasts particles outward to achieve conduction, but this invention inverts the approach by first aligning particles in the desired position and then applying pressure to bond them in place. This reversal of the process sequence achieves both conductivity and position control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances electrical conductivity, stability, and cost-effectiveness, providing a high-performance contact conduction solution for metal structural parts in digital communication products and flat panel displays.
Implementation Method 1
allowing the copper/gold foil surface layer and a bonded part to be conductive respectively to generate a magnetic field around to enhance the attraction of the copper/gold foil surface layer and the bonded part to the conductive particles inside the ACF
Implementation Method 2
the ACF is subject to a special hot pressing and curing process, to be melted, bonded and cured under the three necessary conditions of temperature, time and pressure
Data Source
AI summary
An anisotropic conductive film (ACF) structure and a hot-pressing method and a hot-pressing assembly thereof are provided. The ACF structure includes an ACF and a copper/gold foil surface layer as a substrate. The ACF structure is hot-pressed by a hot-pressing method, which includes the following steps: allowing, when the ACF is in a molten state, the copper/gold foil surface layer and a bonded part to be conductive respectively to generate a magnetic field around to enhance the attraction of the copper/gold foil surface layer and the bonded part to conductive particles inside the ACF; and applying, when the ACF is in a curing stage, a closed circuit to ends of the copper/gold foil surface layer and the bonded part to perform real-time detection on the ACF to ensure the effectiveness of the hot pressing.