Anisotropic Conductive Film for Flip-Chip Package Contact
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Solution Overview
Problem
The existing Flip-Chip Chip-Scale Package manufacturing process faces inaccuracies in conductive opening distance, size, and position, leading to increased costs and manufacturing time, as well as potential insulation failures due to manual placement of insulating layers and conductive openings.
Innovation Solution
The use of an anisotropic conductive film with conductive particles replaces the conventional insulating layer, allowing for precise contact between second electrode pads and second electrical contact pads, reducing manufacturing inaccuracies and improving insulation efficiency by forming high-density conductive areas and an insulating film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conductive openings are manufactured on the insulating layer using manual methods, then the manufacturing process can be completed, but inaccuracies in distance, size, and position occur leading to increased costs and manufacturing time
Solution Approach 1:
The patent replaces manual mechanical placement methods with an anisotropic conductive film that uses compression to activate conductive particles. This substitution eliminates manual positioning errors and reduces manufacturing time by enabling automated film application and compression processes.
Solution Approach 2:
The patent changes the physical state and properties of the insulating layer by using an anisotropic conductive film with conductive particles embedded in an insulating matrix. The film transitions from a non-conductive state to a conductive state through compression, allowing precise control of electrical contact properties while improving manufacturing precision.
2Reliability
If manual placement of insulating layer and conductive openings is used, then the process can be completed, but inaccuracies in contact between electrode pads and contact pads occur
Solution Approach 1:
The patent replaces manual mechanical placement with a compression-based activation system. The anisotropic conductive film is compressed between the substrate and carrier board, automatically positioning conductive particles to ensure accurate electrical contact between pads without manual intervention, thereby improving reliability.
Solution Approach 2:
The anisotropic conductive film performs multiple functions simultaneously: it provides insulation where needed while enabling electrical contact where required. The compression process automatically activates conductivity in the correct locations, eliminating the need for separate manual placement steps and reducing manufacturing complexity.
3Reliability
If an insulating layer with conductive openings is used, then insulation is provided, but the conductive openings require precise manual positioning which increases costs
Solution Approach 1:
The patent uses a composite material structure where conductive particles are embedded within an insulating matrix to form an anisotropic conductive film. This composite structure provides both insulation and conduction properties in a single layer, eliminating the need for separate insulating layer and conductive opening components, thereby reducing manufacturing cost while maintaining reliability.
Solution Approach 2:
The patent replaces the complex multi-step process of creating and positioning conductive openings with a simpler compression-based activation system. The anisotropic conductive film is applied as a complete unit and activated through compression, eliminating costly manual positioning operations while ensuring reliable insulation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution streamlines the manufacturing process, reduces costs, and enhances insulation performance by eliminating manual inaccuracies and ensuring precise contact areas, while maintaining mechanical and thermal benefits of the Flip-Chip Chip-Scale Package structure.
Implementation Method 1
an anisotropic conductive film having a plurality of conductive particles therein and being compressed onto the carrier board, then having the substrate compressing thereon, allowing the bottom surface of the second electrode pads compressing the corresponding conductive particles, causing which to burst and contact with the top surface of the second electrical contact pads
Implementation Method 2
the conductive particles outside the high-density compressed areas that are not burst form an insulating film between the bottom surface of the substrate and the top surface of the carrier board
Data Source
AI summary
An ameliorated compound carrier board structure of Flip-Chip Chip-Scale Package has the insulating layer between the carrier board and the substrate in the prior art replaced by an anisotropic conductive film or materials with similar structure. The anisotropic conductive film has conductive particles therein to replace the conductive openings on the insulating layer in the prior art. When compressing the substrate onto the carrier board, the bottom surface of the second electrode pads are compressing the corresponding conductive particles on the second electrical contact pads, causing which to burst, therefore forming high-density compressed areas that conduct the second electrode pads and the second electrical contact pads; the conductive particles outside the high-density compressed area are not burst, forming an insulating film between the substrate and the carrier board; in other words, the anisotropic conductive film provides conduction in a Z direction. The structure can avoid the inaccuracies of distance and size of the conductive openings and the inaccuracy of the contact between the second electrode pads and the second electrical contact pads.