Anisotropic Conductive Film Resin Composition for LCD Warping Prevention
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-temperature thermocompression bonding of epoxy resin-based anisotropic conductive adhesives causes warping and buckling of flexible and glass epoxy boards, particularly in larger and thinner LCD modules, leading to deteriorated display quality.
Innovation Solution
A resin composition comprising conductive solder particles, epoxy resin, phenoxy resin, and a curing agent with a thiol compound and an amine compound, allowing for low-temperature and short-time curing, preventing excessive solder wet-spreading and ensuring reliable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-temperature thermocompression bonding is used to cure epoxy resin, then complete curing and adhesion are achieved, but warping and buckling of wiring boards occur
Solution Approach 1:
The patent changes the chemical parameters of the curing system by introducing a thiol compound and amine compound as curing agents for epoxy resin. This chemical parameter change enables the curing reaction to proceed at lower temperatures (reducing thermal stress on wiring boards) while still achieving complete curing and reliable adhesion, thus resolving the contradiction between curing completeness and wiring board flatness.
2Strength
If high-temperature bonding is applied, then strong adhesion between electronic components and wiring boards is achieved, but display quality deteriorates due to board warping
Solution Approach 1:
The patent modifies the curing chemistry by using thiol and amine compounds that enable low-temperature curing. This parameter change in the chemical reaction system allows strong adhesion to be achieved without high-temperature processing, thereby preventing warping-induced display quality deterioration while maintaining strong bonding strength.
3Reliability
If long-duration high-temperature curing is used, then complete resin curing is achieved, but productivity decreases due to extended processing time
Solution Approach 1:
The patent changes the kinetic parameters of the curing reaction by selecting thiol and amine compounds as curing agents. These compounds facilitate faster reaction kinetics at lower temperatures, enabling complete curing to be achieved in shorter durations. This resolves the contradiction by improving both curing completeness and processing speed, thereby enhancing productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition cures rapidly at low temperatures, preventing warping and buckling of circuit members, ensuring stable electrical connections and improved adhesion, thus enhancing the reliability and quality of electronic devices.
Implementation Method 1
the resin component contains an epoxy resin and a phenoxy resin, the curing agent contains a first compound having at least one thiol group and a second compound having an amino group
Implementation Method 2
the conductive particles contain solder... electrodes that are provided on the electronic component and electrodes that are provided on the wiring board come into contact with each other via the solder and are electrically connected
Data Source
AI summary
Disclosed is a resin composition that contains conductive particles, a resin component and a curing agent. The conductive particles contain solder, and the resin component contains an epoxy resin and a phenoxy resin. The curing agent contains a first compound having at least one thiol group and a second compound having an amino group.