Dimer Acid-Modified Acrylamide Adhesives for Deep Light Curing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Bismaleimides with a dimer acid skeleton exhibit insufficient curing depth and adhesive strength in light curing, posing challenges for semiconductor devices and electronic components.
Innovation Solution
A curable composition comprising dimer acid-modified acrylamide, a radical polymerization initiator, and optional additives, which can be formulated as a single or multi-component system, enabling excellent light-curing and adhesive properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bismaleimide with dimer acid skeleton is used for light curing, then moisture resistance is improved, but curing depth and adhesive strength are insufficient
Solution Approach 1:
The patent combines dimer acid-modified acrylamide (providing moisture resistance) with conventional acrylamide or other curable components (enhancing adhesive strength and curing depth). This composite approach allows the cured product to simultaneously achieve excellent moisture resistance and sufficient adhesive strength, resolving the contradiction between these two properties.
Solution Approach 2:
The patent modifies the chemical structure by introducing acrylamide groups to the dimer acid skeleton, changing the reactivity and curing characteristics. The acrylamide group provides different polymerization behavior compared to traditional maleimide groups, enabling improved adhesive strength and curing depth while maintaining the moisture resistance benefits of the dimer acid structure.
2Reliability
If bismaleimide with dimer acid skeleton is used for light curing, then moisture resistance is improved, but curing depth is insufficient
Solution Approach 1:
The patent creates a composite curable composition containing dimer acid-modified acrylamide combined with other curable components. This composite system achieves deeper curing penetration while maintaining the moisture resistance properties, as the combined resin system allows for more effective light propagation and polymerization throughout the adhesive layer.
Solution Approach 2:
By changing from traditional maleimide groups to acrylamide groups on the dimer acid skeleton, the patent alters the photopolymerization characteristics. The acrylamide groups exhibit different absorption and reactivity profiles under UV light, enabling deeper curing depth while preserving the moisture resistance inherent to the dimer acid structure.
3Strength
If polymaleimide is used for curable composition, then heat resistance and adhesive strength are improved, but formability is poor due to high crystallinity and melting point
Solution Approach 1:
The patent changes the chemical structure from polymaleimide to dimer acid-modified acrylamide, fundamentally altering the thermal and rheological properties. The new structure maintains high adhesive strength through polar interactions and effective polymerization, while exhibiting lower crystallinity and melting point, thereby improving formability and processability of the curable composition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides improved light-curing depth and adhesive strength, enhancing the reliability of semiconductor devices and electronic components.
Implementation Method 1
photoirradiation in the presence or absence of a photo-radical generator or by heating in the presence of a thermal radical generator
Data Source
Figure 1~2
Figure 3
AI summary
The task is to provide a new substance, a curable composition, an adhesive or sealant containing the new substance with excellent light curability and adhesive strength, a cured product in which the materials have been cured, and a semiconductor device or electronic component containing the cured product, which can solve the problems of bismaleimides having the above dimer acid skeleton. Provided are dimer acid-modified acrylamide, compositions mainly containing dimer acid-modified acrylamide, curable compositions containing dimer acid-modified acrylamide and radical polymerization initiators, adhesives or sealants, cured products in which the curable composition above or the adhesive or sealant above has been cured, and semiconductor devices or electronic components containing such cured products.