Acrylate Pressure-Sensitive Adhesive High Temperature Resilience
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Acrylate pressure-sensitive adhesives fail to provide adequate resistance to resilience, especially at high temperatures, leading to separation issues in consumer electronic products during maritime transport due to deformation of components and materials.
Innovation Solution
A curable composition comprising a monomer component with non-tertiary alcohol (meth)acrylate monomers, acid functionalized non-ester unsaturated monomers, and tackifying resins with specific molecular weights and glass transition temperatures, forming a pressure-sensitive adhesive with enhanced resistance to resilience at high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional acrylate pressure-sensitive adhesives are used, then good weather resistance and cost efficiency are achieved, but resistance to resilience at high temperatures is insufficient
Solution Approach 1:
The patent modifies the chemical composition parameters of the adhesive by incorporating specific monomers (non-tertiary alcohol (meth)acrylate and acid functionalized non-ester unsaturated monomer) and controlling molecular weight and glass transition temperature of tackifying resins. These parameter changes enable the adhesive to maintain reliable bonding at high temperatures while preserving good weather resistance and cost efficiency.
Solution Approach 2:
The patent creates a composite adhesive system combining multiple components: polymerizable monomers, (meth)acrylate polymer tackifying resin with specific molecular weight (10,000-60,000 Daltons) and glass transition temperature (≥20°C), and non-(meth)acrylate polymer tackifying resin with softening point (≥130°C). This composite structure achieves both high temperature resistance and adaptability to various bonding conditions.
2Reliability
If the adhesive is designed for high temperature resistance, then separation prevention is improved, but formulation complexity increases
Solution Approach 1:
The patent applies local quality by assigning specific functional roles to different components at different structural levels. The non-tertiary alcohol (meth)acrylate monomer provides base adhesive properties, the acid functionalized monomer enhances high-temperature resistance, the (meth)acrylate tackifying resin controls flow and bonding, and the non-(meth)acrylate tackifying resin provides thermal stability. This localized functional distribution achieves high temperature reliability without excessive overall complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves the adhesive's resistance to resilience at high temperatures, preventing separation and maintaining bond integrity in electronic products under elevated conditions.
Implementation Method 1
a curable composition, the pressure-sensitive adhesive formed by curing of the curable composition
Data Source
AI summary
The present invention provides a curable composition, a pressure-sensitive adhesive, an adhesive tape and an adherend product, and belongs to the technical field of acrylate pressure-sensitive adhesives. The pressure-sensitive adhesive formed from the curable composition of the present invention features good resistance to resilience, especially resistance to resilience at high temperatures. The curable composition comprises: a monomer component, which comprises at least two polymerizable monomers, wherein the polymerizable monomers comprise a non-tertiary alcohol (meth)acrylate monomer and an acid functionalized non-ester unsaturated monomer with at least one ethylenically unsaturated group; a (meth)acrylate polymer tackifying resin with a weight-average molecular weight ranging from 10,000 to 60,000 Daltons and a glass transition temperature greater than or equal to 20° C.; and a non-(meth)acrylate polymer tackifying resin component, which comprises tackifying resins of at least two non-(meth)acrylate polymers, wherein the softening point temperature of tackifying resins of at least part of the non-(meth)acrylate polymers is greater than or equal to 130° C.