Acrylate-Based Positive Resist Composition for Lithography Defect Reduction
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Solution Overview
Problem
Current resist materials face challenges in achieving excellent lithography properties and reducing defects as miniaturization progresses, particularly in terms of exposure latitude, mask error factor, critical dimension uniformity, and pattern resolution, especially with the increasing use of shorter wavelength exposure sources like KrF and ArF excimer lasers.
Innovation Solution
A positive resist composition incorporating a base component with increased alkali solubility and an acid-generator component, featuring a polymeric compound with specific structural units derived from acrylate esters containing acid-dissociable dissolution inhibiting groups, which enhances the solubility of exposed areas in an alkali developing solution, thereby improving lithography properties and reducing defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional resist materials are used with shorter wavelength exposure sources, then pattern resolution is improved, but lithography properties such as exposure latitude and critical dimension uniformity deteriorate
Solution Approach 1:
The patent modifies the chemical composition parameters of the resist material by incorporating specific carboxylic acid groups and adjusting the ratio of acid-generating components. This changes the chemical reactivity and solubility characteristics of the resist, enabling it to maintain exposure latitude while achieving high resolution with shorter wavelength light sources
Solution Approach 2:
The patent creates a composite resist system combining multiple functional components: a base resin, acid-generating compounds, carboxylic acid groups, and specific additives. This composite structure allows different components to work synergistically, providing both high resolution and reliable lithography properties that single materials cannot achieve
2Productivity
If acid-generator component is added to improve sensitivity, then exposure sensitivity is improved, but pattern shape control deteriorates due to excessive acid generation
Solution Approach 1:
The patent introduces carboxylic acid groups as intermediary substances that mediate between the generated acid and the base resin. These carboxylic acid groups act as buffers that control the rate and extent of base resin deprotection, preventing excessive acid effects while maintaining high sensitivity
Solution Approach 2:
The patent carefully controls the concentration and type of acid-generator component, adjusting this parameter to optimize the balance between sensitivity and pattern control. By precisely tuning the acid generation rate, the system achieves high sensitivity without compromising pattern shape fidelity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resist composition achieves improved lithography properties, including enhanced exposure latitude, reduced defects, and better pattern resolution, by selectively increasing the solubility of exposed areas, allowing for precise and reliable pattern formation.
Implementation Method 1
an acid-generator component (B) which generates acid upon exposure
Data Source
AI summary
A positive resist composition including a base component (A) which exhibits increased solubility in an alkali developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the base component (A) including a polymeric compound (A1) containing a structural unit (a0) represented by general formula (a0-1) shown below and a structural unit (a1) derived from an acrylate ester containing an acid dissociable, dissolution inhibiting group.