Acrylic Resin Film Embossing via Storage Modulus Control
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Solution Overview
Problem
Existing methods for imparting an embossed shape to acrylic resin films lack effectiveness in achieving excellent embossed shape-imparting, film handling, and die-release properties, particularly in applications such as wheeled vehicle interior decorations and building materials.
Innovation Solution
A method involving an embossing die at a specific temperature range (T D +25°C to T D +50°C) with a storage modulus of 0.20 to 0.36 MPa and elongation at break of 100% or more, controlled by the composition and structure of the acrylic resin film, including the use of rubber-containing acrylic resins and specific acrylic processing aids, to enhance embossed shape-imparting and die-release properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the storage modulus of the acrylic resin film is increased to improve embossed shape-imparting property, then the embossed shape transferability is improved, but the die-release property deteriorates
Solution Approach 1:
The invention optimizes the storage modulus parameter to a specific range (0.20 to 0.36 MPa) at a specific temperature (Td + 25°C to Td + 50°C). By precisely controlling this mechanical parameter within the optimal range, the patent achieves a balance where the film is sufficiently rigid to transfer the embossed shape effectively while remaining flexible enough to release from the die without damage.
2Manufacturing precision
If the temperature during embossing is increased to improve embossed shape transferability, then the film becomes more pliable for shaping, but the film handling property deteriorates due to excessive softening
Solution Approach 1:
The invention specifies an optimal embossing temperature range of Td + 25°C to Td + 50°C, where Td is the heat distortion temperature of the acrylic resin film. This parameter optimization ensures the film has sufficient pliability for shape transfer while maintaining adequate handling properties, avoiding excessive softening that would compromise film integrity and handling.
3Strength
If a rigid acrylic resin film is used to maintain film strength, then the mechanical strength is improved, but the embossed shape transferability deteriorates
Solution Approach 1:
The invention identifies that the storage modulus at the specific temperature (0.20 to 0.36 MPa at Td + 25°C to Td + 50°C) is the critical parameter for embossed shape transferability. By controlling the film's mechanical properties to achieve this specific storage modulus range at the processing temperature, the patent enables both adequate film strength and excellent shape transferability, resolving the contradiction between rigidity and formability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method provides excellent embossed shape-imparting, film handling, and die-release properties, suitable for various applications, including wheeled vehicle interior decorations and building materials, with improved productivity and mechanical strength.
Implementation Method 1
the storage modulus (E') under a measurement frequency of 0.1 Hz of the acrylic resin film at the temperature T[°C] is 0.20 to 0.36 Mpa
Data Source
AI summary
Disclosed is a method for imparting an embossed shape to an acrylic resin film by an embossing die at a temperature T[°C] represented by the following formula (1), wherein the storage modulus (E') under a measurement frequency of 0.1 Hz of the acrylic resin film at the temperature T[°C] is 0.20 to 0.36 Mpa and the elongation at break under the following evaluation method is 100% or more: (TD: heat distortion temperature of acrylic resin film) <Evaluation method of elongation at break> Test specimen: film-form material having a thickness of 50 µm and a width of 15 mm Tensile test conditions: initial chuck-to-chuck distance: 50 mm, tensile speed: 500 mm/min, temperature: 23°C; an embossed shape-imparting property, a film handling property and a die-release property being excellent in this method.