Acrylic Primer with SiCH=CH2 Groups for LED Adhesion and Corrosion
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Solution Overview
Problem
The adhesion between a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition is insufficient, leading to potential delamination and corrosion of metal electrodes, especially in high-heat and high-brightness LED applications, where existing primers lack comprehensive heat resistance, adhesion, and corrosion protection.
Innovation Solution
A primer composition comprising an acrylic resin with SiCH=CH2 groups and a solvent, with a silane coupling agent, is used to enhance adhesion and prevent corrosion, with the solvent constituting 90% or more of the primer by weight, improving heat resistance and workability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If an addition reaction curing silicone composition is used as an encapsulant, then heat resistance and productivity are improved, but adhesion between substrate and encapsulant deteriorates
Solution Approach 1:
A primer composition is introduced as an intermediary layer between the substrate and the addition reaction curing silicone composition encapsulant. The primer contains silane coupling agents that chemically bond to both the substrate surface and the silicone encapsulant, creating strong interfacial adhesion while allowing the encapsulant to maintain its excellent heat resistance properties
Solution Approach 2:
The solution employs a composite structure consisting of three layers: substrate, primer composition, and silicone encapsulant. The primer layer is formulated as a composite material containing silane coupling agents, acrylic resins, and solvents, which combines the adhesion properties needed for substrate bonding with the heat resistance required for high-temperature LED operation
2Object-affected harmful factors
If silicone composition is used as encapsulant, then gas permeability is improved, but corrosion resistance of metal electrode deteriorates
Solution Approach 1:
The primer composition acts as a protective intermediary barrier between the metal electrode on the substrate and the silicone encapsulant. The silane coupling agents in the primer form a corrosion-resistant layer that prevents sulfur compounds and other corrosive substances from penetrating through the gas-permeable silicone encapsulant to reach and corrode the metal electrode
Solution Approach 2:
The primer composition creates an inert protective environment around the metal electrode by forming a chemically stable silane-based coating that resists oxidation and sulfuration. This protective layer prevents corrosive substances in the environment from reaching the metal electrode, even though the silicone encapsulant remains gas permeable for its intended function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The primer composition achieves firm adhesion between the substrate and the silicone composition, prevents corrosion of metal electrodes, and enhances the heat resistance of the primer, resulting in a reliable optical semiconductor apparatus with improved mechanical strength and durability.
Implementation Method 1
an acrylic resin containing either one or both of acrylate ester and methacrylate ester that contains one or more SiCH═CH2 groups in the molecule
Data Source
AI summary
The invention provides a primer composition which adheres a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device includes (A) an acrylic resin containing either one or both of an acrylate ester and a methacrylate ester that contains one or more SiCH═CH2 groups in the molecule, and (B) solvent. There can be provided a primer composition in which the adhesion between a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device can be improved, the corrosion of a metal electrode formed on the substrate can be prevented, and the heat resistance of a primer itself can be improved.