Acrylic Resin Underfill for Void-Free Rapid Curing
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Solution Overview
Problem
Conventional resin compositions used for underfilling in semiconductor devices, particularly those containing epoxy resin, often generate voids when cured quickly, leading to reliability issues in the joint between the semiconductor chip and substrate, and may not provide adequate thermal conductivity and moisture resistance.
Innovation Solution
A sealing acrylic resin composition comprising a thermosetting acrylic resin, an organic peroxide, and an inorganic filler with a silane coupling agent, where the inorganic filler is treated with the silane coupling agent to enhance its affinity with the resin, improving thermal conductivity and moisture resistance while preventing void formation during rapid curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a resin composition containing epoxy resin is cured in a short period to improve productivity, then the operation period for sealing is shortened, but voids are generated in the cured product causing reliability decline
Solution Approach 1:
The patent changes the chemical composition parameters of the resin from conventional epoxy resin to a specific acrylic resin system with defined molecular weight (Mc=500-5000) and functional group content. This parameter change enables the resin to cure rapidly without void formation, resolving the contradiction between short curing time and reliability.
Solution Approach 2:
The patent creates a composite resin system combining acrylic resin with specific additives and fillers (including silane-modified fillers at 60-90 mass%). This composite material achieves both rapid curing and void-free solidification, simultaneously improving productivity and maintaining joint reliability.
2Temperature
If the content proportion of inorganic filler is increased to improve thermal conductivity, then thermal conductivity increases, but the resin composition becomes more difficult to handle and may generate voids
Solution Approach 1:
The patent optimizes the particle size distribution parameters of the inorganic filler and controls the silane coupling agent content (0.1-1.0 mass% total organic carbon). These parameter optimizations allow high filler content (60-90 mass%) to be incorporated while maintaining resin flowability and preventing void formation, achieving both high thermal conductivity and ease of operation.
Solution Approach 2:
The patent introduces silane coupling agents as intermediary substances between the inorganic filler and acrylic resin. This intermediary improves the interfacial bonding and dispersion of filler particles, enabling high filler content to be incorporated without compromising handleability or causing voids, thus achieving high thermal conductivity while maintaining ease of operation.
3Strength
If conventional epoxy resin is used for underfilling, then the resin provides good adhesion, but it generates voids when cured quickly and lacks adequate moisture resistance
Solution Approach 1:
The patent fundamentally changes the resin chemistry from epoxy to acrylic system with specific molecular characteristics (Mc=500-5000, specific functional group content). This parameter change provides inherent resistance to void formation during rapid curing and improves moisture resistance while maintaining adhesion strength through the acrylic resin's bonding characteristics.
Solution Approach 2:
The patent develops a composite acrylic resin system incorporating silane-modified inorganic fillers and specific additives. This composite structure provides adhesion equivalent to or better than epoxy resin, while simultaneously achieving void-free rapid curing and superior moisture resistance, resolving all three requirements together.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively seals gaps between semiconductor chips and substrates with high thermal conductivity and moisture resistance, enhancing the reliability and productivity of semiconductor devices by preventing voids and ensuring stable electrical connections.
Implementation Method 1
A silane coupling agent is bonded to the inorganic filler, a total organic carbon content of the inorganic filler in proportion being ranging from 0.1% by mass to 1.0% by mass, inclusive
Implementation Method 2
a resin composition containing a liquid thermosetting acrylic resin is studied... it is possible to cure the resin composition in a short period
Data Source
AI summary
A sealing acrylic resin composition contains a thermosetting acrylic resin in liquid phase, an organic peroxide, and an inorganic filler in a content proportion ranging from 50% by mass to 95% by mass, inclusive. A silane coupling agent is bonded to the inorganic filler, a total organic carbon content of the inorganic filler in proportion being ranging from 0.1% by mass to 1.0% by mass, inclusive, in a state before the inorganic filler is mixed with at least one of the thermosetting acrylic resin and the organic peroxide. The silane coupling agent has an acrylic group.