Acrylic Sealing Composition for Semiconductor Devices
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Solution Overview
Problem
Existing pre-applied underfilling techniques for semiconductor devices face issues with high melt viscosity and low heat resistance when using thermoplastic resins, leading to defects like unfilling and voids, and reduced reliability due to thermoplastic resin addition.
Innovation Solution
An acrylic composition for sealing is developed, containing an acrylic compound, polyphenylene ether resin with radical-polymerizable substituents, an inorganic filler, and a thermal radical polymerization initiator, which can be easily molded into a sheet with low melt viscosity and cured into a high-heat-resistant product, using a nitroxide compound to maintain a low-viscosity state and prevent immediate curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If thermoplastic resin is added to achieve easy molding into sheet, then ease of manufacture is improved, but melt viscosity increases and heat resistance deteriorates
Solution Approach 1:
The patent changes the chemical composition parameters by replacing thermoplastic resin with a specific acrylic compound system that includes a polyphenylene ether resin with radical-polymerizable substituent and thermal radical polymerization initiator. This composition change enables the material to be molded at lower temperatures while achieving high heat resistance through thermal curing, thus resolving the contradiction between ease of molding and heat resistance
Solution Approach 2:
The patent creates a composite sealing material system combining acrylic compound, polyphenylene ether resin with radical-polymerizable substituent, inorganic filler, and thermal radical polymerization initiator. This composite approach provides both the processability needed for sheet molding and the high heat resistance required for semiconductor sealing applications
2Ease of manufacture
If thermoplastic resin is added to facilitate sheet formation, then ease of manufacture is improved, but defects like unfilling and voids occur due to high viscosity
Solution Approach 1:
The patent optimizes the viscosity parameters by using an acrylic compound system with specific molecular weight and functional group content. The composition includes acrylic compound (A) with carboxyl group and acrylic compound (B) without carboxyl group in controlled ratios, along with polyphenylene ether resin, which together provide appropriate viscosity for complete gap filling while maintaining ease of sheet formation
Solution Approach 2:
The patent employs a composite formulation combining multiple acrylic compounds with different properties (carboxyl-containing and carboxyl-free), polyphenylene ether resin with radical-polymerizable substituent, and inorganic filler. This composite system balances processability for sheet formation with low enough viscosity to ensure complete filling and avoid void defects
3Reliability
If conventional acrylic composition is used for sealing, then sealing function is achieved, but heat resistance is insufficient for high-reliability semiconductor devices
Solution Approach 1:
The patent changes the thermal and chemical parameters of the sealing material by incorporating polyphenylene ether resin with radical-polymerizable substituent and thermal radical polymerization initiator. This enables thermal curing at elevated temperatures to form a crosslinked network structure, achieving glass transition temperature of 170°C or higher while maintaining effective sealing function
Solution Approach 2:
The patent develops a high-heat-resistant composite sealing material comprising acrylic compound, polyphenylene ether resin with radical-polymerizable substituent, inorganic filler, and thermal radical polymerization initiator. The synergistic combination of these components provides both reliable sealing performance and high heat resistance required for advanced semiconductor devices
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents defects like unfilling and voids, enhances heat resistance, and improves the reliability of semiconductor devices by maintaining a low-viscosity state during processing and achieving high heat resistance in the cured product.
Implementation Method 1
a thermal radical polymerization initiator... which can be easily molded into a sheet with low melt viscosity and cured into a high-heat-resistant product
Implementation Method 2
using a nitroxide compound to maintain a low-viscosity state and prevent immediate curing
Implementation Method 3
The cured product preferably has a glass transition temperature more than or equal to 170° C.
Data Source
AI summary
The acrylic composition for sealing contains an acrylic compound, a polyphenylene ether resin including a radical-polymerizable substituent at a terminal, an inorganic filler, and a thermal radical polymerization initiator.