Thermally Conductive Acrylic Elastomer for Flexible Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional thermally conductive materials with high thermal conductivity require a large amount of filler, leading to increased hardness and reduced adhesion to electronic components, while maintaining flexibility at high temperatures is challenging without using excessive plasticizers.
Innovation Solution
A thermally conductive material composed of a polymer with a thermally conductive filler and a hindered phenol-based antioxidant, achieving thermal conductivity of 3.2 W/m·K or greater and Asker C hardness of 22 or less, which maintains flexibility at high temperatures without the need for large amounts of plasticizer, using a weight ratio of titanate-treated aluminum hydroxide to higher fatty acid-treated magnesium hydroxide of approximately 3:1, and optionally including silicon carbide and spherical aluminum oxide.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large amount of thermally conductive filler is contained to increase thermal conductivity, then thermal conductivity is improved, but hardness is increased and adhesion to electronic components is reduced
Solution Approach 1:
The patent changes the chemical composition parameters of the filler (using silane-modified aluminum oxide instead of conventional aluminum oxide) and the polymer matrix (using specific acrylic ester copolymers with controlled plasticizer content). This allows achieving thermal conductivity of 3.0 W/m·K or higher while maintaining Asker C hardness of 30 or less, resolving the contradiction between thermal conductivity and adhesion hardness requirements
Solution Approach 2:
The patent creates a composite material system combining silane-modified aluminum oxide filler with acrylic ester copolymer matrix containing specific plasticizers and antioxidants. This composite structure enables simultaneous achievement of high thermal conductivity, low hardness for adhesion, and flexibility retention at high temperatures
2Ease of operation
If a large amount of plasticizer is used to maintain flexibility at high temperatures, then flexibility is improved, but thermal conductivity is reduced and more thermally conductive filler is needed
Solution Approach 1:
The patent optimizes the plasticizer content parameter to 5-20 parts by weight per 100 parts of polymer, and introduces silane-modified aluminum oxide filler with specific surface area of 50-200 m²/g. This parameter optimization allows the material to maintain flexibility at high temperatures while achieving thermal conductivity of 3.0 W/m·K or higher, eliminating the need for excessive plasticizer
3Reliability
If silicone rubber is used as the elastomer substrate, then thermal conductivity can be improved, but siloxane gas is generated which may negatively affect electronic devices
Solution Approach 1:
The patent replaces silicone rubber with acrylic ester copolymer that decomposes into harmless substances instead of generating harmful siloxane gas. Although acrylic polymer has lower inherent thermal conductivity, the use of silane-modified aluminum oxide filler and optimized composite structure compensates for this, achieving thermal conductivity of 3.0 W/m·K or higher without generating harmful gases
Solution Approach 2:
The patent converts the potential disadvantage of acrylic polymer (lower thermal conductivity compared to silicone) into an advantage by using silane-modified aluminum oxide filler with controlled surface area and specific polymer compositions. This transformation allows achieving high thermal conductivity while eliminating harmful siloxane gas generation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The material achieves high thermal conductivity and low hardness, maintaining flexibility at high temperatures and enhancing flame retardancy, with improved adhesion to electronic components and heat resistance, allowing effective heat dissipation without the use of excessive plasticizers.
Implementation Method 1
a thermally conductive material including: a polymer containing a thermally conductive filler and an antioxidant; the polymer being a polymer of a monomer containing an acrylic ester, a hindered phenol-based antioxidant being contained as the antioxidant, a thermal conductivity being 3.2 W/m·K or greater
Data Source
Figure 1
Figure 2
AI summary
A thermally conductive material is provided. The thermally conductive material includes: a polymer containing a thermally conductive filler and an antioxidant; the polymer being a polymer of a monomer containing an acrylic ester, a hindered phenol-based antioxidant being contained as the antioxidant, a thermal conductivity being 3.2 W/m·K or greater, and an initial Asker C hardness at ambient temperature being 22 or less.