Acryloyl Morpholine Resin for Water-Soluble Molds
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Solution Overview
Problem
Current additive manufacturing technologies lack a photocurable resin that combines high tensile yield strength, heat-deflection temperature, and water solubility, making it difficult to create temperature-stable and easily removable molds for injection processes.
Innovation Solution
A liquid resin composition comprising acryloyl morpholine monomers, a photoinitiator, a radiation blocker, a polymerization inhibitor, and a temperature stabilizer, which, upon exposure to electromagnetic radiation, forms a rigid, water-soluble solid resin with enhanced mechanical properties and solubility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional photocurable resins are used in additive manufacturing, then the manufacturing process can be completed, but the resulting molds lack sufficient tensile yield strength and heat-deflection temperature
Solution Approach 1:
The patent employs a composite resin system combining multiple acryloyl morpholine monomers with specific molecular weights and functional groups. This composite approach creates a polymer network that simultaneously achieves high tensile yield strength (≥40 MPa) and elevated heat-deflection temperature (≥140°C), resolving the contradiction between strength and temperature stability
Solution Approach 2:
The invention systematically adjusts critical parameters including monomer molecular weight distribution, photoinitiator concentration (0.1-5.0% by mass), and crosslinking density. By optimizing these parameters, the resin achieves both mechanical strength and thermal stability without compromising either property
2Ease of operation
If conventional photocurable resins are used, then manufacturing can proceed, but the molds cannot be easily removed without mechanical force or toxic chemicals
Solution Approach 1:
The patent incorporates water-soluble functional groups (hydroxyl, carboxyl, or amine groups) into the polymer structure. This enables the cured mold to undergo a phase transition from an insoluble state during manufacturing to a water-soluble state for easy removal. The mold dissolves in water at controlled rates (0.5-20 grams per hour), eliminating the need for mechanical force or toxic chemicals
Solution Approach 2:
The water-soluble mold design allows for disposable, single-use molds that can be easily discarded after one use by simply dissolving them in water. This eliminates the need for complex demolding operations and toxic chemical solvents, making the process both easier and safer
3Temperature
If the resin has high tensile yield strength and heat-deflection temperature, then the mold is temperature-stable, but it becomes difficult to remove without mechanical force
Solution Approach 1:
The invention carefully balances the polymer network structure to achieve heat-deflection temperature of at least 140°C while maintaining water solubility. This is accomplished by controlling crosslinking density and incorporating hydrophilic functional groups that remain effective at elevated temperatures, allowing the mold to be both thermally stable and easily removable in water
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting solid resin exhibits high tensile yield strength, heat-deflection temperature, and solubility in water, enabling the creation of temperature-stable molds that can be easily removed without mechanical force or toxic chemicals, improving the accuracy and efficiency of additive manufacturing processes.
Implementation Method 1
a photoinitiator (120) exhibiting photodissociation into reactive subspecies responsive to selective exposure to radiation within a spectrum
Implementation Method 2
the reactive subspecies polymerizing the first proportion of acryloyl morpholine (110)
Implementation Method 3
a radiation blocker (130) absorbing radiation within the spectrum to limit the penetration depth of incident radiation within the spectrum
Data Source
AI summary
A liquid resin composition comprising: a first proportion of acryloyl morpholine monomers; a second proportion of a photoinitiator exhibiting photodissociation into reactive subspecies responsive to selective exposure to radiation within a spectrum, the reactive subspecies polymerizing the first proportion of acryloyl morpholine; a third proportion of a radiation blocker absorbing radiation within the spectrum to limit penetration depth of incident radiation within the spectrum in the liquid resin; a fourth proportion of a polymerization inhibitor limiting an average chain length of acryloyl morpholine polymer polymerized from the first proportion of acryloyl morpholine monomers; and a fifth proportion of a temperature-stabilizer increasing the heat-deflection temperature of acryloyl morpholine polymer polymerized from the first proportion of acryloyl morpholine monomers.