Actinic-Ray-Sensitive Resin Composition for Semiconductor Patterning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current chemically amplified resist compositions used in semiconductor production face challenges in achieving excellent roughness characteristics and pattern shape without issues of film thinning and trailing, particularly when exposed to far ultraviolet light.
Innovation Solution
A radiation-sensitive resin composition comprising an acid-decomposable resin, an onium salt with a nitrogen-containing cation moiety, and a specific acid-generating compound, which together improve line width roughness and prevent pattern shape defects like trailing and film thinning when exposed to actinic rays or radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional chemically amplified resist compositions are used, then the basic resist function is achieved, but excellent roughness characteristics and pattern shape without film thinning and trailing cannot be simultaneously attained
Solution Approach 1:
The patent uses a composite resist composition containing multiple resin components (cyclic carbonate polymer and carboxylic acid polymer) with specific functional groups, combined with specific photoacid generators. This composite material approach enables simultaneous achievement of smooth sidewalls (roughness control) and accurate pattern shape without film thinning or trailing defects.
Solution Approach 2:
The patent introduces specific functional groups (carboxyl groups with pKa 3-7) at controlled concentrations (0.1-10 mmol/g) within the resin structure to locally enhance acid-base reactions. This local quality modification enables precise control over etch resistance and pattern fidelity without compromising overall roughness characteristics.
2Length of moving object
If higher dimension patterns are formed, then miniaturization requirements are met, but roughness characteristics and pattern shape quality deteriorate
Solution Approach 1:
The patent modifies chemical parameters including the pKa range of carboxyl groups (3-7), their concentration (0.1-10 mmol/g), and the molecular weight of resin components (1,000-100,000). These parameter changes optimize the resist's response to actinic radiation, enabling high-resolution patterning with maintained shape fidelity and roughness control at reduced dimensions.
Solution Approach 2:
The patent replaces reliance on purely physical/mechanical pattern formation with chemically amplified resist mechanisms. The acid-generating photoacid generators and acid-decomposable resin groups create chemical reactions that enhance pattern definition, enabling superior manufacturing precision at higher dimensions compared to conventional approaches.
3Manufacturing precision
If conventional resist compositions are used, then the composition is simple, but roughness characteristics and pattern shape quality cannot be simultaneously optimized
Solution Approach 1:
The patent employs a composite resist composition with cyclic carbonate polymer (containing acid-decomposable groups) and carboxylic acid polymer (containing basic groups with pKa 3-7). This composite structure, while more complex than single-component resists, enables simultaneous optimization of roughness characteristics and pattern shape through coordinated chemical reactions during exposure and development.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively enhances roughness characteristics and pattern rectangularity, preventing film thinning and trailing, thereby improving the overall quality of semiconductor patterns formed.
Implementation Method 1
an onium salt containing a nitrogen atom in its cation moiety, which onium salt when exposed to actinic rays or radiation, is decomposed to thereby generate an acid
Implementation Method 2
a compound that when exposed to actinic rays or radiation, generates an acid
Data Source
AI summary
Provided is an actinic-ray- or radiation-sensitive resin composition including (A) a resin that when acted on by an acid, is decomposed to thereby increase its solubility in an alkali developer, (B) an onium salt containing a nitrogen atom in its cation moiety, which onium salt when exposed to actinic rays or radiation, is decomposed to thereby generate an acid, and (C) a compound that when exposed to actinic rays or radiation, generates an acid, the compound being any of compounds of general formulae (1-1) and (1-2) below.