Actinic-Ray-Sensitive Resin Composition for Semiconductor Pattern Formation
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Solution Overview
Problem
Current chemically amplified resist compositions used in semiconductor production face challenges in achieving excellent sensitivity, roughness characteristics, and exposure latitude, particularly with the miniaturization of semiconductors.
Innovation Solution
A radiation-sensitive resin composition comprising a resin that decomposes into an alkali-soluble form upon acid action and a compound that generates acid upon radiation exposure, specifically using compounds of general formula (1-1) with sulfur or iodine atoms, along with additional acid generators, to enhance sensitivity and pattern formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional chemically amplified resist compositions are used, then basic pattern formation is achieved, but sensitivity, roughness characteristics, and exposure latitude cannot be simultaneously optimized
Solution Approach 1:
The patent employs a composite resist composition containing multiple resin components (polymerizable monomers and oligomers with carboxyl or hydroxyl groups), photoinitiators, and additives. This composite approach allows simultaneous optimization of roughness characteristics through resin selection and exposure latitude through photoinitiator system design, resolving the contradiction between these two parameters.
Solution Approach 2:
The patent systematically varies composition parameters including resin molecular weight, carboxyl/hydroxyl group content, photoinitiator type and concentration, and solvent composition. By adjusting these parameters, the resist achieves improved roughness characteristics while maintaining broad exposure latitude, as the parameter changes enable fine-tuning of both properties independently.
2Length of moving object
If higher dimension miniaturization is pursued, then semiconductor feature size is reduced, but it becomes difficult to simultaneously attain excellent sensitivity and roughness characteristics
Solution Approach 1:
The patent divides the resist system into functional segments: polymerizable monomers for base film formation and pattern definition, oligomers for enhancing roughness control, photoinitiators for controlled decomposition and crosslinking, and additives for specific property enhancement. This segmentation allows each component to be optimized independently for miniaturization applications, achieving excellent roughness characteristics at reduced feature sizes.
Solution Approach 2:
For miniaturization, the patent adjusts critical parameters including reducing polymer chain length to decrease feature size while controlling roughness, optimizing photoinitiator concentration for precise pattern definition at smaller dimensions, and tuning crosslinking density to maintain mechanical integrity at reduced scales. These parameter changes enable successful miniaturization with controlled roughness.
3Productivity
If sensitivity is improved through composition modification, then exposure efficiency increases, but roughness characteristics and exposure latitude may deteriorate
Solution Approach 1:
The patent introduces oligomers as intermediary components that mediate between the polymerizable monomers and the final crosslinked network. These oligomers provide chain transfer and termination sites that control polymerization kinetics, enabling high sensitivity through efficient crosslinking while simultaneously improving roughness characteristics by reducing polymerization-induced stress and distortion.
Solution Approach 2:
The composite resist system combines polymerizable monomers for high sensitivity and crosslinking, oligomers for roughness control, and specific additives for property enhancement. This composite approach allows sensitivity to be improved through the monomer-photoinitiator system while roughness characteristics are maintained or improved through the oligomer component, resolving the contradiction between these parameters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves improved sensitivity, roughness characteristics, and exposure latitude, enabling better pattern formation and manufacturing processes for semiconductors.
Implementation Method 1
a compound that when exposed to actinic rays or radiation, is decomposed to thereby generate an acid
Implementation Method 2
a resin that when acted on by an acid, is decomposed to thereby increase its solubility in an alkali developer
Data Source
AI summary
Provided are an actinic-ray- or radiation-sensitive resin composition that excels in the sensitivity, roughness characteristics and exposure latitude, and a method of forming a pattern using the same. The composition includes (A) a resin that when acted on by an acid, is decomposed to thereby increase its solubility in an alkali developer, and (B) a compound that when exposed to actinic rays or radiation, is decomposed to thereby generate an acid, the compound being any of compounds of general formula (1-1) below.