Actinic Ray-Sensitive Resin Composition for High-Resolution Lithography
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Solution Overview
Problem
In microfabrication processes, particularly for producing high-density information recording media and semiconductor devices, existing actinic ray-sensitive or radiation-sensitive resin compositions face challenges in achieving high sensitivity, high resolution, and excellent roughness characteristics, especially under large area exposure conditions due to issues like backward scattering and degradation reactions that affect pattern resolution.
Innovation Solution
An actinic ray-sensitive or radiation-sensitive resin composition is developed, containing a compound with phenolic hydroxyl groups and specific acid labile groups that are substituted with alkyl, cycloalkyl, or aryl groups, which are designed to minimize degradation reactions and enhance resolution and roughness characteristics by controlling the activation energy of acid degradation reactions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the accelerating voltage of the EB is increased, then the influence of forward scattering is diminished, but the influence of backward scattering is increased, causing resolution deterioration
Solution Approach 1:
The patent changes the chemical composition parameters of the resist film by incorporating specific compounds (formula 1) with controlled molecular structures containing aromatic rings and specific functional groups. This chemical parameter change modifies the electron scattering characteristics and energy loss properties of the resist, thereby reducing backward scattering influence while maintaining high resolution even at increased accelerating voltages
Solution Approach 2:
The patent uses a composite resist composition combining multiple components: the specific compound of formula (1), a basic compound, and a photoacid generator. This composite material approach creates synergistic effects where the formula (1) compound suppresses backward scattering while the basic compound and photoacid generator maintain pattern definition and sensitivity, resolving the contradiction between resolution and scattering influence
2Reliability
If a basic compound is added to inhibit dark reaction, then film reduction in unexposed portion is inhibited, but resolution of independent line pattern deteriorates due to neutralization reaction with scattered electrons
Solution Approach 1:
The patent optimizes the concentration parameter of the basic compound and introduces a specific compound of formula (1) that modifies the chemical environment. This parameter change allows the basic compound to effectively inhibit dark reaction while the formula (1) compound mitigates the harmful neutralization reaction with scattered electrons, preserving resolution
Solution Approach 2:
The compound of formula (1) acts as an intermediary substance between the basic compound and scattered electrons. It modifies the interaction between these components, reducing the harmful neutralization reaction while allowing the basic compound to maintain its function in inhibiting film reduction in unexposed portions
3Ease of manufacture
If acetal group with low activation energy is used as acid labile group, then degradation reaction occurs readily, but film reduction cannot be completely inhibited and resolution deteriorates
Solution Approach 1:
The patent changes the activation energy parameter of the acid labile group by selecting specific compounds of formula (1) with appropriate molecular structures. This parameter change allows the group to degrade at suitable processing temperatures while preventing premature degradation that would cause film reduction and resolution deterioration
Solution Approach 2:
The patent applies different acid labile groups with different activation energies to different positions or types of resin molecules within the resist composition. This local quality approach allows some groups to degrade readily while others provide controlled degradation, balancing ease of manufacture with resolution maintenance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively forms patterns with high sensitivity, high resolution, and excellent roughness characteristics under large area exposure conditions, improving the overall performance of microfabrication processes by reducing the impact of backward scattering and degradation reactions.
Implementation Method 1
a compound (P) that contains at least one phenolic hydroxyl group and at least one group in which a hydrogen atom of a phenolic hydroxyl group has been substituted with a group represented by General Formula (1)... actinic ray-sensitive or radiation-sensitive resin composition
Data Source
AI summary
An actinic ray-sensitive or radiation-sensitive resin composition contains a compound (P) that contains at least one phenolic hydroxyl group and at least one group in which a hydrogen atom of a phenolic hydroxyl group has been substituted with a group represented by the following General Formula (1) (in the formula, M11 represents a single bond or a divalent linking group; Q11 represents an alkyl group, a cycloalkyl group, or an aryl group).


