Actinic Ray Resin Composition for Defect Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing actinic ray-sensitive or radiation-sensitive resin compositions for thick resist films in semiconductor manufacturing suffer from defects that arise over time, particularly in pattern formation processes.
Innovation Solution
An actinic ray-sensitive or radiation-sensitive resin composition with a solid content concentration of 15% or more, comprising a resin with a repeating unit having an acid-decomposable group and an aromatic ring, another resin with a specific repeating unit structure, and a compound that generates acid upon irradiation, where the dispersity of the resin is less than 3.0, and the content of the acid-decomposable group is 5 mol % or less, to reduce defects in patterns formed over time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a thick resist film is used for pattern formation, then the ability to form patterns in semiconductor manufacturing is improved, but defects in the pattern increase after storage over time
Solution Approach 1:
The patent changes the molecular weight distribution parameter of the resin by specifying dispersity less than 3.0, and adjusts the acid-decomposable group content to 5 mol% or less. These parameter changes improve the uniformity of the thick resist film and reduce defects after storage while maintaining pattern formation capability
Solution Approach 2:
The patent uses a composite resin system combining resin (A) with acid-decomposable groups and resin (B) with specific repeating units. This composite material approach allows the thick resist film to maintain both formability and stability over time, resolving the contradiction between pattern formation quality and defect reduction
2Stability of the object's composition
If the dispersity of the resin is reduced to less than 3.0, then the uniformity of mass distribution in the film is improved, but the complexity of resin synthesis and control increases
Solution Approach 1:
The patent specifies a dispersity value of less than 3.0 as a critical parameter to achieve uniform mass distribution in the thick resist film. This parameter control reduces aggregation of components and improves composition stability without requiring excessively complex synthesis procedures
3Reliability
If the content of acid-decomposable groups is limited to 5 mol% or less, then the aggregation of components is suppressed, but the reactivity of the resin for pattern formation may be reduced
Solution Approach 1:
The patent combines resin (A) containing acid-decomposable groups with resin (B) containing specific repeating units in a composite system. By limiting acid-decomposable groups to 5 mol% or less while incorporating resin (B) with complementary properties, the composition suppresses aggregation while maintaining sufficient reactivity for pattern formation through the synergistic effect of the composite materials
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively reduces defects in patterns formed after storage by suppressing aggregation of components and ensuring uniform mass distribution in the film, leading to improved pattern quality and reduced defects.
Implementation Method 1
a compound that generates an acid upon irradiation with an actinic ray or a radiation
Data Source
AI summary
An actinic ray-sensitive or radiation-sensitive resin composition having a concentration of solid contents of 15% or more, the resin composition containing (A) a resin including a repeating unit (a1) having an acid-decomposable group and a repeating unit (a2) having an aromatic ring, (B) a resin including a repeating unit (b1) represented by a specified general formula (1), and (C) a compound that generates an acid upon irradiation with an actinic ray or a radiation. A content of a repeating unit having an acid-decomposable group and included in the resin (B) is 5 mol % or less relative to all repeating units in the resin (B), and the resin (B) has a dispersity of less than 3.0.