Actinic Ray-Sensitive Resin Composition for Line Width Stability

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Solution Overview

Problem

Existing actinic ray-sensitive or radiation-sensitive resin compositions fail to maintain consistent pattern line width due to variations in the waiting time before development, leading to instability in pattern formation during semiconductor manufacturing.

Innovation Solution

The development of an actinic ray-sensitive or radiation-sensitive resin composition that includes a resin undergoing main chain scission upon exposure, acid, base, or heating, with specific groups that decrease polarity or interact with onium salt compounds, ensuring minimal line width variation even with varying waiting times before development.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a conventional resist composition is used, then the development process can be completed, but the line width of the pattern varies significantly when the waiting time before development varies

Engineering Contradiction:
Improveline width consistencyVSAvoidsensitivity stability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent introduces a polymer with specific functional groups (carboxyl, phenolic hydroxyl, or sulfonic acid groups) that undergo chemical changes during post-exposure bake. These parameter changes in the polymer structure compensate for variations in waiting time, maintaining consistent line width across different development timings.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The resist composition combines a polymer with specific functional groups and a glass transition temperature of 50°C or higher with a photoacid generator. This composite material structure enables the system to maintain sensitivity stability and line width consistency even when waiting time varies, by leveraging the synergistic effects of the polymer's thermal properties and the photoacid generator's chemical amplification.

Inventive Principle:
Principle #40Composite materials

2Loss of time

If the waiting time before development is extended, then more time is available for process adjustment, but the sensitivity of the resist film varies and line width control deteriorates

Engineering Contradiction:
Improveprocess flexibilityVSAvoidline width control
Core Design Contradiction:
Loss of timeVSManufacturing precision

Solution Approach 1:

The polymer with specific functional groups performs preliminary action during the post-exposure bake by undergoing chemical modifications that prepare the resist film for subsequent development. This preliminary chemical change ensures that even if waiting time is extended, the line width remains controlled because the polymer has already undergone the necessary structural transformation.

Inventive Principle:
Principle #10Preliminary action

3Productivity

If a resist composition with high sensitivity is used, then exposure efficiency improves, but the line width varies when waiting time varies

Engineering Contradiction:
Improveexposure efficiencyVSAvoidline width consistency
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The polymer with specific functional groups acts as a feedback mechanism that responds to variations in waiting time by undergoing further chemical changes during post-exposure bake. This feedback loop compensates for the sensitivity of high-performance resist compositions, maintaining line width consistency while preserving exposure efficiency.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves consistent pattern line width and stability by reducing intermolecular forces in the resist film, allowing for reliable pattern formation despite variations in development timing.

Implementation Method 1

a resin (X1) that undergoes a decrease in molecular weight caused by scission of a main chain due to action of exposure, acid, base, or heating

Methodology Applied
Scientific EffectPhotodissociation: Photodissociation

Implementation Method 2

a resin (X1) that undergoes a decrease in molecular weight caused by scission of a main chain due to action of exposure, acid, base, or heating

Methodology Applied
Scientific EffectChemical reaction: Chemical Bonding

Data Source

PatentUS20240192598A1Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for producing electronic device
Publication Date: 2024.06.13 FUJIFILM CORP
  • US20240192598A1 patent drawing
  • US20240192598A1 patent drawing
  • US20240192598A1 patent drawing

AI summary

An object of the present invention is to provide an actinic ray-sensitive or radiation-sensitive resin composition that provides a pattern having little variation in the line width even if the time from the end of exposure treatment to the start of development treatment (waiting time before development) varies. Another object of the present invention is to provide a resist film, a pattern forming method, and a method for producing an electronic device that are related to the actinic ray-sensitive or radiation-sensitive resin composition.The actinic ray-sensitive or radiation-sensitive resin composition according to the present invention satisfies a predetermined requirement X or Y.