Active Array Substrate With Barrier Through Holes for Photooxidation Stripping
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for stripping a flexible substrate from a carrier, such as laser stripping and photooxidation, are inefficient due to the inorganic barrier layer preventing oxygen from reaching the photosensitive stripping layer, leading to slow photooxidation and high costs.
Innovation Solution
An active array substrate with an inorganic barrier layer having through holes that expose the flexible substrate, allowing oxygen to reach the photosensitive stripping layer for faster photooxidation, and a manufacturing method involving forming a flexible substrate on a carrier with a photosensitive stripping layer, followed by creating through holes in the inorganic barrier layer and irradiating the photosensitive stripping layer with a light source to reduce adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an inorganic barrier layer covers the flexible substrate to prevent oxygen penetration, then the substrate protection is improved, but the photooxidation speed of the photosensitive stripping layer deteriorates
Solution Approach 1:
The inorganic barrier layer is segmented by forming through-holes that divide the continuous barrier into isolated regions. This allows oxygen to penetrate through the barrier layer to reach the photosensitive stripping layer for photooxidation, while maintaining barrier protection in other areas. The through-holes create localized oxygen access points without compromising overall substrate protection.
Solution Approach 2:
The barrier layer has different properties in different locations: regions with through-holes allow oxygen penetration for photooxidation, while regions without through-holes maintain oxygen barrier functionality. This local differentiation enables simultaneous achievement of substrate protection and efficient photooxidation stripping.
2Ease of operation
If laser stripping is used to remove the substrate from the carrier, then the substrate can be separated effectively, but the manufacturing cost increases
Solution Approach 1:
The patent replaces the mechanical/thermal laser stripping system with a chemical photooxidation system. By using photosensitive stripping layer that undergoes chemical oxidation when exposed to light, the need for expensive laser equipment is eliminated. The photooxidation process uses conventional UV or visible light sources instead of high-power lasers, significantly reducing manufacturing costs while achieving effective substrate-carrier separation.
3Ease of manufacture
If photooxidation is used to strip the substrate from the carrier, then the manufacturing cost is reduced, but the process time increases due to slow oxidation
Solution Approach 1:
The photosensitive stripping layer is prepared in advance with specific photooxidation properties before the manufacturing process. The layer is designed to undergo rapid oxidation when exposed to light, and the through-holes in the barrier layer are pre-formed to ensure immediate oxygen access. This preliminary preparation enables fast photooxidation when the stripping step is activated, reducing overall process time.
Solution Approach 2:
The photooxidation process is accelerated by using strong oxidizing conditions created through light exposure. The photosensitive stripping layer contains organic materials that undergo rapid oxidation when activated by light in the presence of oxygen. The through-holes ensure sufficient oxygen supply to the reaction sites, enabling fast oxidation rates that reduce the stripping time while maintaining cost-effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method significantly reduces the time required to manufacture the active array substrate by enhancing the photooxidation of the photosensitive stripping layer, thereby improving the efficiency of the substrate removal process.
Implementation Method 1
the photosensitive stripping layer is exposed to ultraviolet light and is oxidated so that the adhesion between the substrate and the carrier is reduced
Data Source
AI summary
An active array substrate includes a flexible substrate, an inorganic barrier layer, and at least one active component. The inorganic barrier layer covers the flexible substrate. The inorganic barrier layer has a through hole therein. The through hole of the inorganic barrier layer exposes the flexible substrate. The active component is disposed on the inorganic barrier layer.