Active-by-Active Programmable Device SiP Bridge Cost Reduction
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Solution Overview
Problem
Modern programmable devices, such as FPGAs, face increasing costs due to advanced process technology and overhead of programmability, making traditional monolithic architectures unsustainable for cost-sensitive applications. Additionally, existing system-in-package (SiP) solutions rely on expensive packaging techniques, limiting their benefits to high-end applications.
Innovation Solution
The development of an active-by-active programmable device using a system-in-package (SiP) architecture, which includes a programmable IC die and a companion IC die mounted on a package substrate. The programmable IC die features a programmable fabric without application circuitry, while the companion IC die includes application circuitry. A SiP bridge with conductive interconnects electrically couples the IO circuits between the two IC dies, enabling data aggregation and dispersal through aggregation and dispersal circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional monolithic architectures are used, then device functionality is integrated, but manufacturing cost increases due to advanced process technology requirements
Solution Approach 1:
The device is divided into two separate IC dies: a programmable IC die containing the programmable fabric and SiP IO circuits, and a companion IC die containing the application circuitry. These dies are manufactured separately using different process technologies and then mounted together on a package substrate, eliminating the need for the entire device to be manufactured using expensive advanced process technology.
Solution Approach 2:
A package substrate serves as an intermediary component that mechanically and electrically connects the programmable IC die and the companion IC die. The substrate provides conductive interconnects that enable signal transmission between the two dies, allowing them to function as an integrated system while being manufactured separately.
2Ease of manufacture
If advanced packaging techniques are used, then device integration is achieved, but manufacturing cost increases due to expensive interposers and complex three-dimensional die stacking
Solution Approach 1:
The packaging approach is segmented into simpler components: two IC dies mounted side-by-side on a package substrate using conventional wire bonding or flip-chip techniques. This avoids the need for complex three-dimensional die stacking and expensive interposer substrates, reducing both cost and manufacturing precision requirements.
Solution Approach 2:
The patent employs cost-effective packaging materials and techniques, such as standard package substrates and conventional interconnect methods, replacing expensive advanced packaging components like interposers. This approach prioritizes cost-effectiveness over maximum integration density, making the solution suitable for cost-sensitive applications.
3Ease of manufacture
If all circuit blocks are included in a monolithic device, then device functionality is complete, but overhead of programmability increases cost for applications that do not require all features
Solution Approach 1:
The device functionality is segmented between the programmable IC die and the companion IC die. The programmable fabric provides reconfigurability for applications requiring programmability, while the companion IC die contains fixed application circuitry for applications that don't need full programmability. This allows the system to be configured appropriately for different application needs without paying for unnecessary features.
Solution Approach 2:
Different parts of the system have different levels of programmability: the programmable IC die provides full programmability where needed, while the companion IC die provides fixed functionality where programmability is not required. This local differentiation of quality allows cost optimization by providing programmability only where it is actually needed in the application.
Data Source
AI summary
An example integrated circuit (IC) system includes a package substrate having a programmable integrated circuit (IC) and a companion IC mounted thereon, the programmable IC including a programmable fabric and the companion IC including application circuitry. The IC system further includes a system-in-package (SiP) bridge including a first SiP IO circuit disposed in the programmable IC, a second SiP IO circuit disposed in the companion IC, and conductive interconnect on the package substrate electrically coupling the first SiP IO circuit and the second SiP IO circuit. The IC System further includes first aggregation and first dispersal circuits in the programmable IC coupled between the programmable fabric and the first SiP IO circuit. The IC system further includes second aggregation and second dispersal circuits in the companion IC coupled between the application circuitry and the second SiP IO circuit.