Active Components on Internal Cable for Signal Integrity

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Solution Overview

Problem

Current internal cable systems for electronic devices, such as SCSI cables, face challenges in maintaining signal integrity due to the limitations of passive components and heat dissipation issues with active components when encapsulated in over-molded connectors, requiring additional circuit boards and cabling at increased costs.

Innovation Solution

A printed circuit board with active components is mechanically and electrically connected to standard connectors, exposing it to the cooling airflow within the electronic device to enhance signal integrity, using active redriving integrated circuits and a power regulator, while maintaining a secure mechanical attachment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If active components are encapsulated in over-molded connectors, then mechanical protection is improved, but heat dissipation deteriorates and signal integrity is compromised

Engineering Contradiction:
Improvemechanical protectionVSAvoidheat dissipation
Core Design Contradiction:
StrengthVSTemperature

Solution Approach 1:

The connector is divided into two distinct portions: an over-molded portion providing mechanical protection and shielding, and an exposed portion allowing heat dissipation and signal access. This segmentation resolves the contradiction by separating the protective function from the thermal management function.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different portions of the connector have different properties: the over-molded portion provides mechanical strength and EMI shielding, while the exposed portion allows thermal dissipation and signal integrity. This local differentiation of properties resolves the contradiction between protection and heat dissipation.

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If passive components are used in internal cable systems, then cost is reduced, but signal integrity deteriorates

Engineering Contradiction:
ImprovecostVSAvoidsignal integrity
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The invention merges the connector housing with an integrated circuit board containing active components. This combination allows the system to achieve high signal integrity through active signal conditioning while maintaining cost-effectiveness by integrating components into a single assembled unit rather than requiring separate expensive cable assemblies.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The connector assembly serves multiple functions: mechanical connection, EMI shielding, signal conditioning through active components, and heat dissipation. This multi-functionality resolves the contradiction by providing signal integrity enhancement without requiring additional separate components that would increase cost.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If additional circuit boards and cabling are added to enhance signal integrity, then signal-to-noise ratio is improved, but device complexity and cost increase

Engineering Contradiction:
Improvesignal-to-noise ratioVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The circuit board is integrated directly into the connector assembly, combining what would traditionally be separate components (connector housing, circuit board, active components) into a single unified assembly. This integration reduces device complexity while maintaining signal integrity enhancement through the active components.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively enhances signal integrity by amplifying and conditioning signals, minimizing crosstalk, and allowing for proper heat dissipation without the need for separate cooling, thus improving the signal-to-noise ratio and reducing costs by leveraging the device's internal cooling system.

Implementation Method 1

exposed to air flow from a cooling system of the electronic device

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS8228689B2Active components on an internal cable to improve signal integrity
Publication Date: 2012.07.24 AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE LTD
  • US8228689B2 patent drawing
  • US8228689B2 patent drawing
  • US8228689B2 patent drawing

AI summary

Disclosed is an internal cable system that communicates signals in an electronic device. The system uses a printed circuit board with active circuits that is connected to a standard communication cable. The printed circuit board is exposed to air flow from the cooling system of the electronic device for proper operation of the active components of the active circuits on the printed circuit board. The standard cable may include a SCSI internal cable or other similar signal communication cables. Signal integrity is enhanced using the active circuits that are mounted on the printed circuit board. Power is supplied to the printed circuit board through inactive conductors in the cable or conductors that would otherwise be used for grounding.