Active Cable Movable Heat Sink for Semiconductor Cooling
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Solution Overview
Problem
The geometry of active cable connectors and computer card connectors makes it difficult to properly couple a heatsink in close proximity to semiconductor chips, which are used for data signal processing and generate heat, requiring effective cooling solutions.
Innovation Solution
An active cable with a movable heatsink that is thermally coupled to the semiconductor chip, which extends from a retracted position to an extended position when the cable connector is seated in the card connector, allowing for exposure to free airflow for cooling, and is positioned within the cable and card connector housings for optimal heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heatsink is coupled in close proximity to the semiconductor chip, then cooling effectiveness is improved, but the cable connector geometry prevents proper coupling
Solution Approach 1:
The heatsink is designed to be movable rather than fixed, allowing it to transition from a retracted position during insertion to an extended position for cooling. This dynamic configuration enables the heatsink to overcome the geometric constraints of the cable connector housing while maintaining close thermal coupling with the semiconductor chip when in the extended position.
Solution Approach 2:
The movable heatsink is nested within the cable connector housing in the retracted position, allowing it to be stored compactly during insertion. When extended, it protrudes through the housing to achieve the necessary cooling effectiveness, effectively nesting the cooling mechanism within the constrained connector geometry.
2Loss of energy
If the heatsink is extended through the cable connector housing, then heat dissipation is improved, but the connector geometry makes this difficult to achieve
Solution Approach 1:
The heatsink transitions from a static to a dynamic component, moving from a retracted to an extended position after insertion. This allows the system to achieve effective heat dissipation through the cable connector housing without requiring the entire connector assembly to be redesigned for extended cooling surfaces.
Solution Approach 2:
The cooling function is segmented from the main connector body, with the heatsink operating as an independent movable component. This segmentation allows the heatsink to extend through the housing for effective heat dissipation while the main connector geometry remains unchanged and compatible with standard card connectors.
3Productivity
If the semiconductor chip is positioned for optimal cooling, then performance is maintained, but the cable connector geometry prevents proper heatsink positioning
Solution Approach 1:
The movable heatsink enables optimal positioning relative to the semiconductor chip after insertion, ensuring that the chip is properly cooled to maintain data processing performance. The dynamic positioning capability overcomes the static geometric constraints of the cable connector housing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The movable heatsink effectively provides adequate cooling for semiconductor chips by exposing it to freestream airflow, ensuring efficient heat dissipation and maintaining the performance of active cables in data processing applications.
Implementation Method 1
a heat sink thermally coupled to the semiconductor chip
Implementation Method 2
The heat exchanger is positioned within the cable connector housing in the retracted position. At least a portion of the heat exchanger extends through the cable connector housing and the card connector in the extended position
Data Source
AI summary
A cable, system, and method for cooling a semiconductor chip on an active cable. The active cable includes a heat sink that is thermally coupled to the semiconductor chip and movable from a retracted position to an extended position. The heat sink is in the retracted position when the active cable is not installed in a card connector in a computer case. After the active cable is installed in the card connector, the heat sink is urged to the extended position in which the heat sink is exposed to air flow circulation within the computer case.