Active Carbonate Semiconductor Compound for Substrate Modification
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Solution Overview
Problem
Current methods for forming patterns on substrates for fine devices, such as semiconductor elements and organic EL displays, are limited in their ability to simultaneously modify the substrate and introduce semiconductor characteristics, often requiring multiple steps and materials.
Innovation Solution
A compound with an active carbonate structure and semiconductor characteristics is used to chemically modify the substrate, allowing for the simultaneous modification of an aminated surface and introduction of semiconductor groups, thereby omitting the need for a wiring formation base film and enabling the formation of an organic semiconductor base film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple separate materials and steps are used to modify substrate and introduce semiconductor characteristics, then the modification can be thorough, but the process complexity increases and productivity decreases
Solution Approach 1:
The patent combines multiple functional groups into a single compound molecule: an active carbonate group for reacting with amino groups on the substrate, and a semiconductor characteristic group (such as tetracene, rubrene, or pentacene) for providing semiconductor properties. This merging allows one compound to perform multiple functions that previously required separate materials and steps, thereby simplifying the process and improving productivity while maintaining thorough substrate modification
Solution Approach 2:
The compound designed in the patent serves multiple purposes simultaneously: it acts as a coupling agent to bind to the aminated substrate surface, introduces semiconductor characteristics to enable charge transport, and forms a base film for subsequent wiring formation. This multi-functionality eliminates the need for separate wiring formation base films and reduces the number of process steps
2Reliability
If a wiring formation base film is used separately, then the semiconductor characteristics can be introduced, but the number of process steps increases
Solution Approach 1:
The patent merges the function of the wiring formation base film with the substrate modification step by incorporating the semiconductor characteristic group directly into the coupling agent molecule. This eliminates the need for a separate wiring formation base film step, as the compound itself provides the necessary semiconductor properties for subsequent wiring formation processes
Solution Approach 2:
The coupling agent compound serves universally as both the substrate modifier and the semiconductor characteristic introducer, replacing the need for separate wiring formation base film materials. This multi-functional approach reduces device complexity by consolidating multiple functions into a single material and process step
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient and direct introduction of semiconductor characteristics onto substrates, simplifying the pattern formation process and facilitating the creation of organic semiconductor base films, which enhances the production of fine devices by integrating semiconductor properties into the substrate.
Implementation Method 1
chemically modifying the aminated surface using the compound according to the first embodiment of the present invention
Data Source
AI summary
What is provided is a compound, a pattern forming substrate, a coupling agent, and a pattern formation method. The compound is represented by Formula (1).[in the formula, X01 represents a group exhibiting semiconductor characteristics and Y represents a divalent linking group]