Active Cooling Devices in Memory Modules for Heat Dissipation
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Solution Overview
Problem
As computer processing systems generate more heat due to increased processing activity and smaller component sizes, there is a growing need for improved heat dissipation methods to prevent damage to transistor circuits and maintain performance.
Innovation Solution
The integration of active cooling devices, such as thermoelectric devices or liquid cooling systems, directly on the memory chips or substrates within memory modules to enhance heat dissipation and manage temperatures effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If more transistor circuits are included in smaller packages to increase processing capability, then processing functionality is improved, but heat generation increases and heat dissipation becomes more difficult
Solution Approach 1:
The patent extracts the heat dissipation function from the traditional passive heat sink approach and implements it as a separate active cooling device that can be independently controlled and optimized. The cooling device is disposed on the substrate and thermally coupled to memory chips, allowing heat to be actively pumped away from the memory module.
Solution Approach 2:
The active cooling device serves multiple functions: it cools memory chips during high-performance operations, maintains optimal temperatures during idle states, and can be integrated into various memory module configurations. The system adapts its cooling intensity based on operational requirements.
2Temperature
If active cooling devices are added to memory modules to improve heat dissipation, then temperature control is improved, but device complexity increases
Solution Approach 1:
The patent merges the active cooling device with the existing memory module structure by disposing it on the substrate and thermally coupling it to the memory chips. This integration approach allows the cooling function to be added without requiring separate mounting hardware or complex assembly procedures.
Solution Approach 2:
The substrate serves as an intermediary between the memory chips and the active cooling device, providing thermal coupling while maintaining electrical isolation. This mediator approach simplifies the overall system architecture by using existing components to facilitate heat transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of active cooling devices in memory modules effectively reduces or maintains temperatures, thereby saving power, improving performance, and extending the lifespan of memory chips and other components.
Implementation Method 1
In some examples, the active cooling device is a thermoelectric device
Data Source
AI summary
Memory modules comprise memory chips coupled to a surface of one or more substrates. The memory chips contain large numbers of storage cells that consume power during normal operation, generating heat in the memory chips and causing temperatures to increase. As the temperatures increase, leakage currents can increase in the memory chips, and performance of the memory chips can decrease. A memory module includes memory chips disposed on a substrate and an active cooling device disposed on the substrate to increase the rate at which heat is dissipated to reduce or maintain temperatures and thereby save power and improve performance. In some examples, the active cooling device is disposed on a side of a memory chip opposite to the card in the memory module to improve cooling of the memory chips. In some examples, the active cooling device is a thermoelectric device.