Active Cooling Provisioning in 3D Stacked Die Packages
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Solution Overview
Problem
Conventional heat dissipation techniques in 3D multi-die electronic package modules are inadequate for high-density, high-speed systems, leading to reduced performance and potential early failure due to insufficient cooling.
Innovation Solution
A method and system for managing cooling in 3D packages using active cooling mechanisms, such as thermoelectric coolers and controllable cooling fluid systems, strategically placed to optimize heat removal while minimizing energy consumption, with a controller that adjusts cooling based on workload and environmental conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If passive cooling provisioning is used in 3D multi-die electronic package modules, then the structure is simple and energy consumption is low, but the cooling effectiveness is insufficient for high-density, high-speed systems
Solution Approach 1:
The patent implements dynamic cooling control by selectively activating specific thermoelectric coolers based on real-time temperature monitoring and workload conditions. The system transitions from static passive cooling to dynamic active cooling, adjusting cooling provision on-demand to match actual thermal requirements, thereby improving cooling effectiveness while managing energy consumption efficiently.
Solution Approach 2:
The patent applies localized cooling by positioning thermoelectric coolers at specific high-heat-generation locations within the 3D multi-die package rather than using uniform cooling across all die. This targeted approach concentrates cooling resources where most needed, enhancing cooling effectiveness in critical areas without proportionally increasing overall energy consumption.
2Temperature
If active cooling mechanisms are continuously activated to maximize cooling effectiveness, then temperature control is improved, but energy consumption increases
Solution Approach 1:
The patent employs periodic monitoring and control of cooling mechanisms based on workload cycles and temperature thresholds. Rather than continuous operation, thermoelectric coolers are activated periodically when temperature thresholds are exceeded or workload increases, maintaining adequate temperature control while minimizing unnecessary energy consumption during low-demand periods.
Solution Approach 2:
The patent implements a feedback control system using temperature sensors to monitor die temperatures and adjust cooling provision accordingly. The controller receives temperature feedback and dynamically adjusts thermoelectric cooler activation and intensity, ensuring adequate temperature control only when and where needed, thereby optimizing the balance between temperature control and energy consumption.
3Temperature
If more thermoelectric coolers are added to increase cooling capacity, then cooling effectiveness is improved, but device complexity and energy consumption increase
Solution Approach 1:
The patent divides the cooling system into multiple independently controllable thermoelectric cooler segments positioned between different die layers. Each cooler can be selectively activated based on local thermal conditions, allowing the system to achieve high cooling capacity where needed while maintaining manageable device complexity through modular, distributed control rather than a single complex cooling system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages cooling in 3D packages by selectively activating active cooling mechanisms, optimizing energy efficiency and ensuring adequate heat dissipation, thereby enhancing performance and extending the lifespan of the electronic components.
Implementation Method 1
The active cooling mechanisms include a plurality of thermoelectric coolers, each having a first end and a second end. The first end of each thermoelectric cooler is coupled to a different one of the plurality of stacked die. The thermoelectric coolers are configured to remove heat from the first die and deliver the heat to the second die.
Implementation Method 2
A first thermal interface material is positioned between the first die and the first end of the first thermoelectric cooler. A second thermal interface material is positioned between the second die and the second end of the first thermoelectric cooler.
Data Source
AI summary
In a method for managing cooling provisioning in a three-dimensional package containing a plurality of stacked die with a cooling system having at least one active cooling mechanism, at least one of workload on and an environmental condition at or around one of the plurality of stacked die is identified. In addition, at least one of the active cooling mechanism and the one of the plurality of stacked die is controlled based upon at least one of the identified workload and environmental condition.