3D Active Element Interconnect Layout With Insulating Sidewall Isolation
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Solution Overview
Problem
In high-resolution light display screens and imaging sensors, the accurate matrix formation of light-emitting diodes and sensors is hindered by the difficulty in electrical connections due to their three-dimensional structure, leading to risks of short-circuits and damage to light conversion elements, especially when high temperatures are involved.
Innovation Solution
An electronic device with a lower support and conductive elements, where active elements have a lower portion connected to lower conductive elements and an upper portion connected to upper conductive elements, with electrically insulating elements between them to prevent short-circuits, allowing for robust and cost-effective electrical insulation and connection without high temperature processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermocompression method is used to create electrical connection between light elements and second support, then electrical connection is achieved, but high temperature damages light conversion elements
Solution Approach 1:
The device is divided into multiple layers with distinct functions: active elements layer, first conductive layer, second conductive layer, and insulating layers. This segmentation allows electrical connections to be established through distributed contact points rather than requiring high-temperature compression of the entire structure, thereby protecting temperature-sensitive light conversion elements while achieving reliable electrical connectivity.
Solution Approach 2:
An insulating layer is introduced as an intermediary between the first and second conductive layers. This intermediary enables electrical connections to be made through side walls of active elements without direct contact between opposing conductive layers, eliminating the need for high-temperature thermocompression and protecting light conversion elements from thermal damage.
2Adaptability or versatility
If three-dimensional wired diodes are used, then light emission functionality is achieved, but electrical connection becomes difficult due to distance between upper and lower parts
Solution Approach 1:
The electrical connection structure transitions from a vertical one-dimensional approach to a multi-dimensional solution. The second conductive layer is positioned laterally adjacent to active elements rather than directly opposite, utilizing the lateral dimension to establish connections. This dimensional shift simplifies the connection structure by eliminating the need for precise vertical alignment across large distances.
Solution Approach 2:
The insulating layer is positioned within the space between the first and second conductive layers, nesting the insulation function within the existing electrical connection structure. This nested arrangement enables the side wall connection approach while maintaining compact device geometry and avoiding the complexity of extended vertical connections.
3Manufacturing precision
If high resolution matrix formation is required, then screen resolution is improved, but accuracy requirements increase making manufacturing more difficult
Solution Approach 1:
The insulating layer is formed in advance before the second conductive layer is deposited. This preliminary action defines the connection regions and spacing in advance, allowing subsequent manufacturing steps to proceed with standard precision requirements rather than requiring ultra-precise alignment. The pre-formed insulating structure guides the formation of conductive patterns at high resolution without compounding accuracy demands.
Data Source
AI summary
An electronic device for capturing or emitting a physical quantity includes a lower support; lower conductive elements; active elements including an active part and each including a lower portion electrically connected to at least one of the lower conductive elements and an upper portion; and upper conductive elements. The upper portion of each active element is electrically connected to one of the upper conductive elements. At least one first electrically insulating element is arranged between the lateral wall of at least two adjacent active elements disposed side by side on the support surface of the lower support. The first electrically insulating element is arranged between one of the upper conductive elements and one of the lower conductive elements.