Active Ester Compound for Low Dielectric and Adhesion
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Solution Overview
Problem
Existing resin materials for semiconductors and printed wiring boards lack sufficient copper foil adhesion and dielectric properties, particularly with the miniaturization of electronic components, where thermal resistance, moisture absorption resistance, and low dielectric constants are required.
Innovation Solution
An active ester compound with a fluorinated hydrocarbon structural moiety and multiple aromatic ester structural moieties, including an aryloxycarbonyl or arylcarbonyloxy structure, is used to form a cured product with excellent dielectric and copper foil adhesion properties, serving as a curing agent for epoxy resins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If polytetrafluoroethylene dispersion is added to epoxy resin to reduce dielectric constant and dielectric loss tangent, then dielectric properties are improved, but copper foil adhesion properties deteriorate
Solution Approach 1:
The invention uses a composite curing agent system comprising both a fluorinated compound (to provide dielectric properties) and a carboxylic acid compound (to provide copper foil adhesion). This composite approach allows the resin composition to simultaneously achieve low dielectric constant/loss tangent and high copper foil adhesion, resolving the contradiction between dielectric performance and adhesion performance that occurs when only polytetrafluoroethylene dispersion is used.
2Speed
If resin materials are formulated for low dielectric constant and dielectric loss tangent, then signal speed and frequency are improved, but copper foil adhesion properties deteriorate
Solution Approach 1:
The patent employs a composite curing agent formulation where a fluorinated compound (providing low dielectric constant and loss tangent for high signal speed) is combined with a carboxylic acid compound (providing copper foil adhesion). This dual-component curing agent system enables the resin to simultaneously achieve high signal speed performance and adequate copper foil adhesion, overcoming the limitation of conventional single-function formulations.
3Volume of moving object
If electronic components are miniaturized, then device size is reduced, but requirements for thermal resistance, moisture absorption resistance, and copper foil adhesion increase
Solution Approach 1:
The invention uses a composite curing agent system combining fluorinated compounds (for dielectric properties) and carboxylic acid compounds (for adhesion and thermal resistance). This formulation approach enables miniaturized electronic components to maintain high reliability in terms of thermal resistance, moisture absorption resistance, and copper foil adhesion, even as device size decreases and these properties become more critical.
Solution Approach 2:
The patent modifies the chemical composition parameters of the curing agent system by introducing specific fluorinated compounds and carboxylic acid compounds in controlled ratios. This parameter optimization allows the resin to achieve enhanced thermal resistance and adhesion properties necessary for miniaturized components, while maintaining processability and other required properties.
Data Source
AI summary
An active ester compound that can form a cured product having excellent dielectric properties and copper foil adhesion properties is provided, a curable composition including the active ester compound is provided, and a cured product of the curable composition is provided. Also provided are a semiconductor encapsulating material, a printed wiring board, and a build-up film formed by using the curable composition. Specifically, an active ester compound is provided which includes a fluorinated hydrocarbon structural moiety and a plurality of aromatic ester structural moieties in the structure of the molecule and includes an aryloxycarbonyl structure or an arylcarbonyloxy structure at an end of the molecule, a curable composition including the active ester compound, and a cured product of the curable composition, and also provided are a semiconductor encapsulation material, a printed wiring board, and a build-up film formed by using the curable composition.